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Chemical characterization of failures and process materials for microelectronics assembly

Chemical characterization of failures and process materials for microelectronics assembly Purpose – The purpose of this paper is to discuss the chemical characterization of failures and process materials for microelectronics assembly. Design/methodology/approach – The analytical techniques used for chemical structures and compositions including Fourier transform infrared spectrometer (FTIR), scanning electron microscopy, and energy‐dispersive X‐ray spectroscopy are conducted. Findings – The residues on the golden finger are identified to be the flux used in the assembly processes. Besides, the contaminants on the processed and incoming connector pins are verified to be polyamides (–CONH functional groups) from housing material's residue. Three liquid fluxes used in wave soldering are analyzed by their chemical structure. One flux showing the OH groups at 3430 cm −1 indicates higher acid contents. This consists with the acidic values specified by the supplier. Also, the solder mask under study has ever appeared peeled‐off issue. The FTIR spectra results indicated 62.2 percent degree of curing while vendor's spec is above 70 percent. Originality/value – The establishment of the Infrared spectra database for fluxes and process materials help determine the root cause of the contaminants to reduce re‐occurrence of similar problems and thus enhance the manufacturing capability. The infrared spectrophotometry technique can be used by professional original design manufacturing and/or electronics manufacturing service, providers to investigate board/component defects during product pilot run stage and volume production. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Chemical characterization of failures and process materials for microelectronics assembly

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Publisher
Emerald Publishing
Copyright
Copyright © 2009 Emerald Group Publishing Limited. All rights reserved.
ISSN
1356-5362
DOI
10.1108/13565360910981553
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to discuss the chemical characterization of failures and process materials for microelectronics assembly. Design/methodology/approach – The analytical techniques used for chemical structures and compositions including Fourier transform infrared spectrometer (FTIR), scanning electron microscopy, and energy‐dispersive X‐ray spectroscopy are conducted. Findings – The residues on the golden finger are identified to be the flux used in the assembly processes. Besides, the contaminants on the processed and incoming connector pins are verified to be polyamides (–CONH functional groups) from housing material's residue. Three liquid fluxes used in wave soldering are analyzed by their chemical structure. One flux showing the OH groups at 3430 cm −1 indicates higher acid contents. This consists with the acidic values specified by the supplier. Also, the solder mask under study has ever appeared peeled‐off issue. The FTIR spectra results indicated 62.2 percent degree of curing while vendor's spec is above 70 percent. Originality/value – The establishment of the Infrared spectra database for fluxes and process materials help determine the root cause of the contaminants to reduce re‐occurrence of similar problems and thus enhance the manufacturing capability. The infrared spectrophotometry technique can be used by professional original design manufacturing and/or electronics manufacturing service, providers to investigate board/component defects during product pilot run stage and volume production.

Journal

Microelectronics International – Emerald Publishing

Published: Jul 31, 2009

Keywords: Chemical properties of materials; Contamination; Electronic engineering; Assembling; Quality control

References

  • α‐ϒ Transition of nylon 6
    Arimoto, H.
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    Dunaway, J.B.
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    Hirt, A.; Artaki, I.
  • Surface Organic Contaminant Identification Test (Infrared Analytical Method)
    IPC‐TM‐650.2.3.39
  • Scanning Electron Microscopy and X‐ray Microanalysis
    Lee, R.E.
  • Lead‐free and no‐clean soldering for automotive electronics
    Shangguan, D.; Gao, G.
  • Failure analysis of electronic components and interconnection systems
    Smith, C.A.
  • Chemical characterisation of materials in electronic systems using infrared spectroscopy
    Smith, C.A.
  • Feasibility study of OSEE inspection for flux residue on electronics assemblies
    Welch, C.S.