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References (5)
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J. Lahti, R. Delaney, J. Hines (1979)
The Characteristic Wearout Process in Epoxy-Glass Printed Circuits for High Density Electronic Packaging17th International Reliability Physics Symposium
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P. Boddy, R. Delaney, J. Lahti, E. Landry, R. Restrick (1976)
Accelerated Life Testing of Flexible Printed Circuits14th International Reliability Physics Symposium
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T. Welsher, J. Mitchell, D. Lando (1980)
CAF in Composite Printed-Circuit Substrates: Characterization, Modeling and a Resistant Material18th International Reliability Physics Symposium
-
D. Bono (1989)
The Assessment of the Corrosivity of Soldering Flux Residues Using Printed Copper Circuit Board TracksSoldering & Surface Mount Technology, 1
-
D. Lando, J. Mitchell, T. Welsher (1979)
Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention17th International Reliability Physics Symposium
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 0954-0911
- DOI
- 10.1108/eb037752
- Publisher site
- See Article on Publisher Site
Abstract
A new corrosion test for assessing flux residues is applied to marginally cleaned water soluble fluxed test boards and low solidsno clean fluxed test boards. This test method developed by Bono has been modified to accelerate the corrosion process. The corrosion mechanism observed in this study is conductive anodic filament CAF, a corrosion mechanism proposed in 1979 by Lando et al. It is postulated that this degradation mechanism is due to the high bias voltage 190 V coupled with the high humidity 85 and high temperature 85C conditions used in this test. Important parameters in the test method are discussed and recommended refinements are given.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Feb 1, 1991