Access the full text.
Sign up today, get DeepDyve free for 14 days.
Loading next page...
/lp/emerald-publishing/characterising-the-corrosion-properties-of-flux-residues-ULd6I5951F
References (1)
-
D. Bono (1989)
The Assessment of the Corrosivity of Soldering Flux Residues Using Printed Copper Circuit Board TracksSoldering & Surface Mount Technology, 1
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 0954-0911
- DOI
- 10.1108/eb037802
- Publisher site
- See Article on Publisher Site
Abstract
Today's emphasis on alternative flux technology as an approach to eliminate the use of chlorofluorocarbons CFCs requires an understanding of the corrosion potential of the new fluxes. In 1989, Dr David Bono proposed that monitoring the effect of different soldering fluxes on the rate of corrosion of a copper wire printed on a circuit board would provide quantitative information on the corrosion potential of a flux. Further analysis of this testby Turbini et al. revealed that the degradation mechanism associated with Bono's test is the growth of conductive anodic filaments along the glass fibres of the epoxyglass boards. The original test method has been revised, and the test coupon redesigned with the goal of developing a standard, quantitative test method to characterise soldering fluxes. This paper will describe the equipment, test coupon and electrical circuitry associated with this proposed test method. Procedures chosen to reduce error sources associated with electrical noise will be reported and explained.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Mar 1, 1992