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CBGA solder joint thermal fatigue life estimation by a simple method

CBGA solder joint thermal fatigue life estimation by a simple method A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic SnPb solder on both top and bottom of the ball. A closed‐form solution, based on the calculation of the equilibrium of the displacements within the electronic package assembly, was first derived in order to calculate the solder joint strains during temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution for the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials. A fatigue life prediction model was established. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

CBGA solder joint thermal fatigue life estimation by a simple method

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Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910410537327
Publisher site
See Article on Publisher Site

Abstract

A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic SnPb solder on both top and bottom of the ball. A closed‐form solution, based on the calculation of the equilibrium of the displacements within the electronic package assembly, was first derived in order to calculate the solder joint strains during temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution for the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials. A fatigue life prediction model was established.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Aug 1, 2004

Keywords: Soldering; Joining processes; Fatigue; Thermal properties of materials

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