Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Calculation of Solder Joint Volume for TAB and MCR Components

Calculation of Solder Joint Volume for TAB and MCR Components This paper describes ways of simplifying the equations characterising the equilibrium shape of reflowed solder in the interconnection of TAB Tape Automated Bonding and MCR Moulded Carrier Ring components with negligible loss in accuracy. A drastic reduction of the numerical effort necessary to calculate the solder volume for fine pitch devices is achieved. The equations are applied to TAB and MCR packages which are hotbarsoldered to a substrate. The results of these calculations are in good agreement with experimental data. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Calculation of Solder Joint Volume for TAB and MCR Components

Loading next page...
 
/lp/emerald-publishing/calculation-of-solder-joint-volume-for-tab-and-mcr-components-9j49YMPtvJ
Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037789
Publisher site
See Article on Publisher Site

Abstract

This paper describes ways of simplifying the equations characterising the equilibrium shape of reflowed solder in the interconnection of TAB Tape Automated Bonding and MCR Moulded Carrier Ring components with negligible loss in accuracy. A drastic reduction of the numerical effort necessary to calculate the solder volume for fine pitch devices is achieved. The equations are applied to TAB and MCR packages which are hotbarsoldered to a substrate. The results of these calculations are in good agreement with experimental data.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Feb 1, 1992

There are no references for this article.