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Blowholing in PTH Solder Fillets

Blowholing in PTH Solder Fillets This is the third paper in the series of eight, studying voids and blowholes in PTH printed circuit boards. In the previous papers the industrial significance of this problem has been established and moisture identified as the primary cause of the gassing. Now, particular attention is focused on the understanding of the mechanisms and kinetics of moisture uptake in the FR4 laminate. From the authors' data the rate of moisture uptake and the rate of drying of laminate can be predicted as a function of temperature and relative humidity. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Blowholing in PTH Solder Fillets

Circuit World , Volume 12 (4): 8 – Mar 1, 1986

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References (3)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043833
Publisher site
See Article on Publisher Site

Abstract

This is the third paper in the series of eight, studying voids and blowholes in PTH printed circuit boards. In the previous papers the industrial significance of this problem has been established and moisture identified as the primary cause of the gassing. Now, particular attention is focused on the understanding of the mechanisms and kinetics of moisture uptake in the FR4 laminate. From the authors' data the rate of moisture uptake and the rate of drying of laminate can be predicted as a function of temperature and relative humidity.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1986

There are no references for this article.