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Base, Substrate Materials for the Construction of Electronic Assemblies Special Application of Surface Mount Technology Printed Circuit Boards

Base, Substrate Materials for the Construction of Electronic Assemblies Special Application of... The general section of the paper discusses in detail the demands of SMDTechnology on Printed Circuit Boards, namely dimensional, thermal, electrical and chemical requirements on both substrates and finished PCBs, besides characteristic features of the production process and the overall performance of the assembly. The second part is concerned with a survey of materials and methods suitable for the needs of SMT printed circuitry. Emphasis is laid on appropriate substrates, thermal management of assemblies and PCBs for high speedhigh frequency applications http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Base, Substrate Materials for the Construction of Electronic Assemblies Special Application of Surface Mount Technology Printed Circuit Boards

Circuit World , Volume 12 (4): 4 – Mar 1, 1986

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043836
Publisher site
See Article on Publisher Site

Abstract

The general section of the paper discusses in detail the demands of SMDTechnology on Printed Circuit Boards, namely dimensional, thermal, electrical and chemical requirements on both substrates and finished PCBs, besides characteristic features of the production process and the overall performance of the assembly. The second part is concerned with a survey of materials and methods suitable for the needs of SMT printed circuitry. Emphasis is laid on appropriate substrates, thermal management of assemblies and PCBs for high speedhigh frequency applications

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1986

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