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Automation in action at the latest PackExpo show

Automation in action at the latest PackExpo show Purpose – This paper aims to provide a review of the most recent PackExpo show in Chicago with emphasis on the new automation innovations and applications on display. Design/methodology/approach – In‐depth interviews are carried out with exhibitors of automated packaging machinery at the show. Findings – Automation continues to address an ever‐increasing number of packaging tasks. Practical implications – Customers may be surprised at the extent to which automation innovations are available and the new applications that are being addressed. Originality/value – This paper is a review of some of the latest packaging automation innovations and applications that one might have seen if they had been on the exhibition floor at the most recent Chicago PackExpo show. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Assembly Automation Emerald Publishing

Automation in action at the latest PackExpo show

Assembly Automation , Volume 33 (3): 7 – Jul 26, 2013

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Publisher
Emerald Publishing
Copyright
Copyright © 2013 Emerald Group Publishing Limited. All rights reserved.
ISSN
0144-5154
DOI
10.1108/AA-01-2013-004
Publisher site
See Article on Publisher Site

Abstract

Purpose – This paper aims to provide a review of the most recent PackExpo show in Chicago with emphasis on the new automation innovations and applications on display. Design/methodology/approach – In‐depth interviews are carried out with exhibitors of automated packaging machinery at the show. Findings – Automation continues to address an ever‐increasing number of packaging tasks. Practical implications – Customers may be surprised at the extent to which automation innovations are available and the new applications that are being addressed. Originality/value – This paper is a review of some of the latest packaging automation innovations and applications that one might have seen if they had been on the exhibition floor at the most recent Chicago PackExpo show.

Journal

Assembly AutomationEmerald Publishing

Published: Jul 26, 2013

Keywords: Automation; Packaging; Pick and place; Filling; Sealing materials; Industrial robotics; Palletizing

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