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/lp/emerald-publishing/automatic-inspection-of-component-boards-using-3d-and-greyscale-vision-JjY6G0cGAq
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/eb044268
- Publisher site
- See Article on Publisher Site
Abstract
Recently great interest has developed for a high speed, flexible machine vision system which can accurately determine solder paste and component placement for both process verification and quality control inspection. Present SMT inspection systems must cope with the unpredictable appearance of components and backgrounds and are often used only to determine presence and absence. This paper describes a new approach which combines greyscale data with a threedimensional map of the board under test. Originally this method was proposed as a robust technique for locating components in low contrast greyscale images. However, experience working with manufacturers and developers of placement equipment has shown that emerging SMT inspection requirements indicate the importance of threedimensional information. In addition to the detection of components and measurement of orientation, examples are shown of solder paste volume measurements, lead coplanarity, and tombstone effect detection.
Journal
Microelectronics International – Emerald Publishing
Published: Feb 1, 1987