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Assessment of Temperature Distributions in Electronic Circuits

Assessment of Temperature Distributions in Electronic Circuits A study has been undertaken into the use of thermal imaging techniques to determine the temperature distribution of electronic equipment. The suitability of such techniques was investigated to determine the level of confidence that could be established with regard to temperature readings obtained. The study consisted of the comparison of temperatures measured directly using fine wire thermocouples with those obtained from a thermal imaging system. Results showed that surface emissivity was a crucial factor in the determination of accurate temperatures by imaging techniques. However, by coating areas to be studied with a light deposit of aluminium chlorohydrate, a constant highly emissive surface could be obtained. This permitted temperature measurements to be made with an accuracy to within <1 C over the temperature range 30 to 90C. The thermal imaging system was used to study the effect of component colour and of component density on temperature distribution. It was found, with respect to the component spacing, that the maximum component temperature was critically related to the spacing between the devices. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Assessment of Temperature Distributions in Electronic Circuits

Page, G.; Campbell, D.S.
Microelectronics International , Volume 9 (2): 4 – Feb 1, 1992
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References (5)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044569
Publisher site
See Article on Publisher Site

Abstract

A study has been undertaken into the use of thermal imaging techniques to determine the temperature distribution of electronic equipment. The suitability of such techniques was investigated to determine the level of confidence that could be established with regard to temperature readings obtained. The study consisted of the comparison of temperatures measured directly using fine wire thermocouples with those obtained from a thermal imaging system. Results showed that surface emissivity was a crucial factor in the determination of accurate temperatures by imaging techniques. However, by coating areas to be studied with a light deposit of aluminium chlorohydrate, a constant highly emissive surface could be obtained. This permitted temperature measurements to be made with an accuracy to within <1 C over the temperature range 30 to 90C. The thermal imaging system was used to study the effect of component colour and of component density on temperature distribution. It was found, with respect to the component spacing, that the maximum component temperature was critically related to the spacing between the devices.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1992

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