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Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors

Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors Indium solders are frequently used for interconnections in cooled systems because of their high ductility down to very low temperatures. Very fine contact pitches are required for hybrid mosaic radiation sensors compared with those for conventional flipchip technology. This paper presents solutions for bumping and bonding indium bumps based on the measured properties of indium solders in relation to the requirements of, and possibilities for, manufacture of fine pitch solder bump features. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044447
Publisher site
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Abstract

Indium solders are frequently used for interconnections in cooled systems because of their high ductility down to very low temperatures. Very fine contact pitches are required for hybrid mosaic radiation sensors compared with those for conventional flipchip technology. This paper presents solutions for bumping and bonding indium bumps based on the measured properties of indium solders in relation to the requirements of, and possibilities for, manufacture of fine pitch solder bump features.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1991

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