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References (5)
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J. Rode (1983)
Hybrid HgCdTe Arrays, 0443
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M. Plötner, G. Blasek, G. Sadowski, S. Rzepka (1990)
Hybridization of Cooled Mosaic Sensors by Indium-Bumps -
R. Broudy, M. Gurnee, S. Iwasa, T. Tredwell, J. White (1978)
Infrared/Charge Coupled Devices (IR/CCD) Hybrid Focal Planes, 0132
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P. Hall (1987)
Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip CarriersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 10
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(1986)
Advances in linear and two dimensional CdHgTe-Si hybrid focal plane arrays
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/eb044447
- Publisher site
- See Article on Publisher Site
Abstract
Indium solders are frequently used for interconnections in cooled systems because of their high ductility down to very low temperatures. Very fine contact pitches are required for hybrid mosaic radiation sensors compared with those for conventional flipchip technology. This paper presents solutions for bumping and bonding indium bumps based on the measured properties of indium solders in relation to the requirements of, and possibilities for, manufacture of fine pitch solder bump features.
Journal
Microelectronics International – Emerald Publishing
Published: Feb 1, 1991