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- Publisher
- Emerald Publishing
- Copyright
- © Emerald Publishing Limited
- ISSN
- 0954-0911
- DOI
- 10.1108/ssmt-03-2017-0010
- Publisher site
- See Article on Publisher Site
Abstract
This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the desired inspection specification is determined to reduce the expected total process loss.Design/methodology/approachStatic Taguchi parametric design is applied while considering the noise factors possibly affecting the printing quality in the production environment. The Taguchi quality loss function model is then proposed to evaluate the two types of inspection strategies.FindingsThe optimal parameter-level treatment for the solder paste printing process includes a squeegee pressure of 11 kg, a stencil snap-off of 0.14 mm, a cleaning frequency of the stencil once per printing and using an air gun after stencil wiping. The optimal upper and lower specification limits are 119.8 µm and 110.3 µm, respectively.Originality/valueNoise factors in the production environment are considered to determine the optimal printing process. For specific components, the specification is established as a basis for subsequent processes or reworks.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Aug 15, 2018
Keywords: Process specification; Quality loss function; Solder paste printing; Taguchi parametric design