Access the full text.
Sign up today, get DeepDyve free for 14 days.
Loading next page...
/lp/emerald-publishing/applying-data-mining-methodology-to-establish-an-intelligent-decision-gYWJCIDRi2
References (27)
-
Time-based reflow soldering optimization by using adaptive Kriging-HDMR method
Soldering & Surface Mount Technology, 18
-
Liming Chen, Enying Li, Hu Wang (2016)
Reflow soldering optimization by using adaptive Kriging-HDMR methodSoldering & Surface Mount Technology
-
Y. Zhou, M. Al-Bassyiouni, A. Dasgupta (2010)
Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder AlloysIEEE Transactions on Components and Packaging Technologies, 33
-
T. Tsai (2011)
Improving the fine-pitch stencil printing capability using the Taguchi method and Taguchi fuzzy-based modelRobotics and Computer-integrated Manufacturing, 27
-
Wei Cheng, Xiuying Zhang, Ke Wang, X. Dai (2009)
Integrating classification and regression tree (CART) with GIS for assessment of heavy metals pollutionEnvironmental Monitoring and Assessment, 158
-
H.P. Soto (1998)
Study of the thermal behavior of a printed circuit board during the reflow process inside a surface mount technology oven -
Shen-Tsu Wang (2013)
Integrating the Taguchi method and the multiattribute decision-making method to optimize the surface mount technology solder paste printing thickness processProceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 227
-
Ching-Chin Chern, Seak-Tou Lei, Kwei-Long Huang (2014)
Solving a multi-objective master planning problem with substitution and a recycling process for a capacitated multi-commodity supply chain networkJournal of Intelligent Manufacturing, 25
-
Chenxiao Qiao, Yuning Shi, Nelson Vicera, Matthew Poon, Weiqiang Li, Haibin Chen, Jingshen Wu (2012)
Improvement of pick & place yield in carrier tape packaging system through materials selection and cavity structure optimization2012 14th International Conference on Electronic Materials and Packaging (EMAP)
-
Duen-Yian Yeh, Ching-Hsue Cheng, Shih-Chuan Hsiao (2011)
Classification knowledge discovery in mold tooling test using decision tree algorithmJournal of Intelligent Manufacturing, 22
-
Xi He, Ziyu Liu, Jian Cai, Yu Chen, Lin Tan, Qian Wang (2014)
Characterization of stencil printing parameters for fine pitch wafer bumping2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy
-
P. Srimani, V. Prathiba (2016)
Adaptive Data Mining Approach for PCB Defect Detection and ClassificationIndian journal of science and technology, 9
-
T. Merkle, R. Gotzen (2015)
Millimeter-Wave Surface Mount Technology for 3-D Printed Polymer Multichip ModulesIEEE Transactions on Components, Packaging and Manufacturing Technology, 5
-
Chien-Yi Huang, Hui-Hua Huang, Kuo-Ching Ying (2012)
Sn–Cu–Ni Soldering Process Optimization Using Multivariate AnalysisIEEE Transactions on Components, Packaging and Manufacturing Technology, 2
-
J. Bath, R. Jay, L. Bennett, S. Tan, Pan Chih, A. Lucuta (2007)
Repeatability Analysis of EDXRF Equipment for RoHS Compliance Screening for Soldering Materials used in PCBA Manufacturing2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium
-
Chien-Yi Huang, Yueh‐Hsun Lin, Kuo-Ching Ying, C. Ku (2011)
The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reductionSoldering & Surface Mount Technology, 23
-
R. Koleňák (2017)
Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides additionSoldering & Surface Mount Technology, 29
-
Jenn-Wei Lin, A. Selvi, Joesph Arul (2016)
A performance-satisfied and affection-aware MapReduce allocation scheme for intelligent information applications2016 IEEE International Conference on Knowledge Engineering and Applications (ICKEA)
-
T. Tsai, Chiung-Wen Tsai (2014)
DEVELOPMENT OF A CLOSED-LOOP DIAGNOSIS SYSTEM FOR REFLOW SOLDERING USING NEURAL NETWORKS AND SUPPORT VECTOR REGRESSION -
J. Borecki, T. Serzysko (2016)
Mechanical reliability of solder joints in PCBs assembled in surface mount technologySoldering & Surface Mount Technology, 28
-
Chien-Yi Huang, Hui-Hua Huang (2014)
Process optimization of SnCuNi soldering material using artificial parametric designJournal of Intelligent Manufacturing, 25
-
Raghavendra Kune, P. Konugurthi, A. Agarwal, C. Rao, R. Buyya (2015)
The anatomy of big data computingSoftware: Practice and Experience, 46
-
Yi-Chung Hu, Ruey-Shun Chen, G. Tzeng (2003)
Discovering fuzzy association rules using fuzzy partition methodsKnowl. Based Syst., 16
-
C. Lau, C. Khor, D. Soares, J. Teixeira, M. Abdullah (2016)
Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a reviewSoldering & Surface Mount Technology, 28
-
Chien-Yi Huang (2015)
Innovative parametric design for environmentally conscious adhesive dispensing processJournal of Intelligent Manufacturing, 26
-
Chien-Yi Huang, Yueh‐Hsun Lin (2013)
Applying CHAID algorithm to investigate critical attributes of void formation in QFN assemblySoldering & Surface Mount Technology, 25
-
Yen-Liang Chen, Cheng-Hsiung Weng (2008)
Mining association rules from imprecise ordinal dataFuzzy Sets Syst., 159
- Publisher
- Emerald Publishing
- Copyright
- © Emerald Publishing Limited
- ISSN
- 0954-0911
- DOI
- 10.1108/ssmt-10-2018-0036
- Publisher site
- See Article on Publisher Site
Abstract
This paper aims to consider the practical production environment of electronics manufacturing industry firms, and the large quantities of information collected on machine processes, testing data and production reports, while simultaneously taking into account the properties of the processing environment, in conducting analysis to obtain valuable information.Design/methodology/approachThis research constructs a prediction model of the circuit board assembly process yield. A decision tree is used to extract the key attributes. The authors also integrate association rules to determine the relevance of key attributes of undesirable phenomena.FindingsThe results assure the successful application of the methodology by reconfirming the rules for solder skip and short circuit occurrence and their causes.Originality/valueMeasures for improvement are recommended, production parameters determined and debugging suggestions made to improve the process yield when the new process is implemented.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Aug 21, 2019
Keywords: Data mining; A priori; Printed circuit board assembly; Process defective