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Application of Experimental Design to the Solder Paste Screen Printing Process

Application of Experimental Design to the Solder Paste Screen Printing Process Experimental design has proved to be a useful statistical tool in reducing process variation. The technique has been applied to a wide range of processes, including electronics assembly and soldering processes. For effective SMT assembly the screen printing of solder paste requires tight process control, especially as pad geometries become ever smaller. However, printing of solder paste is a rather complex process which is affected by machine, material, environmental and human factors, which make it difficult to characterise effectively. This paper examines the practical application of experimental design to solder paste printing for SMT and also the results from a number of experiments carried out on a semiautomatic clamshell type screen printer. The experimentation concentrates on the important printer and squeegee parameters and their effect on paste deposition, with measured solder paste height and measle diagrams used as process outputs. The usefulness of the experimental results in determining the best printer settings, as well as the problems encountered during the experimentation, are highlighted. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Application of Experimental Design to the Solder Paste Screen Printing Process

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037784
Publisher site
See Article on Publisher Site

Abstract

Experimental design has proved to be a useful statistical tool in reducing process variation. The technique has been applied to a wide range of processes, including electronics assembly and soldering processes. For effective SMT assembly the screen printing of solder paste requires tight process control, especially as pad geometries become ever smaller. However, printing of solder paste is a rather complex process which is affected by machine, material, environmental and human factors, which make it difficult to characterise effectively. This paper examines the practical application of experimental design to solder paste printing for SMT and also the results from a number of experiments carried out on a semiautomatic clamshell type screen printer. The experimentation concentrates on the important printer and squeegee parameters and their effect on paste deposition, with measured solder paste height and measle diagrams used as process outputs. The usefulness of the experimental results in determining the best printer settings, as well as the problems encountered during the experimentation, are highlighted.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Feb 1, 1992

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