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Application of Electrochemical Principles to Acid Copper Plating

Application of Electrochemical Principles to Acid Copper Plating Plating productivity is often limited by the deposition rate of the electrolytic copper system. Using electrochemical engineering principles, a high speed copper process has been developed which addresses this need. This paper describes the new high speed system and illustrates how the same electrochemical fundamentals can be applied to high aspect ratiohigh throw requirements. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Application of Electrochemical Principles to Acid Copper Plating

Circuit World , Volume 13 (4): 4 – Mar 1, 1987

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References (5)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043905
Publisher site
See Article on Publisher Site

Abstract

Plating productivity is often limited by the deposition rate of the electrolytic copper system. Using electrochemical engineering principles, a high speed copper process has been developed which addresses this need. This paper describes the new high speed system and illustrates how the same electrochemical fundamentals can be applied to high aspect ratiohigh throw requirements.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1987

There are no references for this article.