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Analysis of the Ballforming Process in Copper Ball Bonding

Analysis of the Ballforming Process in Copper Ball Bonding Pulse control, SEM analysis and metallographic examination have been used to record and study the process by which a ball is formed at the tip of an ultrafine copper wire. The process by which the copper ball is formed, and the laws governing this process, are presented. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Analysis of the Ballforming Process in Copper Ball Bonding

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037774
Publisher site
See Article on Publisher Site

Abstract

Pulse control, SEM analysis and metallographic examination have been used to record and study the process by which a ball is formed at the tip of an ultrafine copper wire. The process by which the copper ball is formed, and the laws governing this process, are presented.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jan 1, 1992

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