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An overview of microvia technology

An overview of microvia technology There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO2 laser, YAG laser, and excimer; photo-defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

An overview of microvia technology

John H. Lau; Chris Chang
Circuit World , Volume 26 (2): 11 – Jun 1, 2000
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11 pages

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Publisher
Emerald Publishing
Copyright
Copyright © 2000 MCB UP Ltd. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120010310891
Publisher site
See Article on Publisher Site

Abstract

There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO2 laser, YAG laser, and excimer; photo-defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.

Journal

Circuit World – Emerald Publishing

Published: Jun 1, 2000

Keywords: Printed circuit boards; Build‐up technology

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