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An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards

An innovative “ChemicalVia” process for the production of high density interconnect printed... The ChemicalVia process, patented by CERN, provides a new method of making microvias in high‐density multilayer printed circuit boards of different types, such as sequential build‐up (SBU), high density interconnected (HDI), or laminated multi‐chip modules (MCM‐L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards

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Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120410539885
Publisher site
See Article on Publisher Site

Abstract

The ChemicalVia process, patented by CERN, provides a new method of making microvias in high‐density multilayer printed circuit boards of different types, such as sequential build‐up (SBU), high density interconnected (HDI), or laminated multi‐chip modules (MCM‐L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes.

Journal

Circuit WorldEmerald Publishing

Published: Dec 1, 2004

Keywords: Printed‐circuit boards; Material‐removal processes

References