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After CFCs

After CFCs The options for eliminating CFC113 as a solvent for cleaning flux residues from soldered circuit assemblies, or minimising the need to clean, are now clear diluted CFC solvent blends, new HCFC solvents, alcohols, water plus saponifier, water with watersoluble flux, semiaqueous solvents, noclean fluxes and controlled atmosphere soldering. This paper summarises the advantages and the limitations of each option and presents a methodology first suggested by Northern Telecom for ranking the options in a way that is specific to the requirements of the user. Both the cost and the technical feasibility of the implementation of each option are considered to provide a quantitative measure that can form the basis for the decision making which option best fits my requirements and my resources http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

After CFCs

Circuit World , Volume 18 (1): 6 – Apr 1, 1991

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References (1)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046152
Publisher site
See Article on Publisher Site

Abstract

The options for eliminating CFC113 as a solvent for cleaning flux residues from soldered circuit assemblies, or minimising the need to clean, are now clear diluted CFC solvent blends, new HCFC solvents, alcohols, water plus saponifier, water with watersoluble flux, semiaqueous solvents, noclean fluxes and controlled atmosphere soldering. This paper summarises the advantages and the limitations of each option and presents a methodology first suggested by Northern Telecom for ranking the options in a way that is specific to the requirements of the user. Both the cost and the technical feasibility of the implementation of each option are considered to provide a quantitative measure that can form the basis for the decision making which option best fits my requirements and my resources

Journal

Circuit WorldEmerald Publishing

Published: Apr 1, 1991

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