Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs

Advances on high current load effects on lead-free solder joints of SMD chip-size components and... This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries. The investigation involves a numerical approach and a physical validation with selected geometry configurations and high current loads to reveal possible failure sources. The work is a continuation of a previous study.Design/methodology/approachCurrent density was investigated using finite element modeling on BGA joints. Dummy BGA components, 0402 and 0603 zero ohm jumper resistors, were used, both in daisy chain setups on standard FR4 printed circuit boards (PCBs). Respective physical loading experiments were set to find effects of elevated current density at hot zones of the joints. Cross-section analysis, scanning electron microscopy and shear force tests were used to analyze the joints.FindingsThe findings reveal alterations in the joints, while the current loading is not directly affecting the structure. The modeling reveals the current density map in the selected formations with increased current crowding zones. Overall, the degradation does not reach the level of electromigration (EM)-induced voiding due to the limiting factor of the FR4 substrate.Practical implicationsThe heavy current load affects joint reliability, but there are limitations of EM-induced failures on PCB-based assemblies due to the thermomechanical weakness of the FR4 material.Originality/valueThe experiments investigate current density from a novel aspect on frequently used BGA surface mounted components with modeling configurations focusing on possible effects of via-in-pad structure. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs

Loading next page...
 
/lp/emerald-publishing/advances-on-high-current-load-effects-on-lead-free-solder-joints-of-h7nS2B8mfT

References (34)

Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0305-6120
DOI
10.1108/cw-11-2018-0088
Publisher site
See Article on Publisher Site

Abstract

This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries. The investigation involves a numerical approach and a physical validation with selected geometry configurations and high current loads to reveal possible failure sources. The work is a continuation of a previous study.Design/methodology/approachCurrent density was investigated using finite element modeling on BGA joints. Dummy BGA components, 0402 and 0603 zero ohm jumper resistors, were used, both in daisy chain setups on standard FR4 printed circuit boards (PCBs). Respective physical loading experiments were set to find effects of elevated current density at hot zones of the joints. Cross-section analysis, scanning electron microscopy and shear force tests were used to analyze the joints.FindingsThe findings reveal alterations in the joints, while the current loading is not directly affecting the structure. The modeling reveals the current density map in the selected formations with increased current crowding zones. Overall, the degradation does not reach the level of electromigration (EM)-induced voiding due to the limiting factor of the FR4 substrate.Practical implicationsThe heavy current load affects joint reliability, but there are limitations of EM-induced failures on PCB-based assemblies due to the thermomechanical weakness of the FR4 material.Originality/valueThe experiments investigate current density from a novel aspect on frequently used BGA surface mounted components with modeling configurations focusing on possible effects of via-in-pad structure.

Journal

Circuit WorldEmerald Publishing

Published: Jun 7, 2019

Keywords: Current density; Electromigration; Chip-size components; BGA joints; Via-in-pad

There are no references for this article.