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Advanced PWB Materials for Surface Mounted Devices in Aerospace Applications

Advanced PWB Materials for Surface Mounted Devices in Aerospace Applications Faced with LCCC growth and their widespread acceptance for military applications, Crouzet has planned a twoway approach for SMDs with MLTF multilayer thick film hybrids and advanced PWBs. This paper deals with the R&D programme carried out on both technologies. It briefly addresses MLTF interconnects under a CNES qualification programme and now being used and describes PWB R&D first investigation and screening, optimisation programme and improvement of large advanced PWB processing. Data are given on the material analysis, TCE measurements, MLB assembly, PTH platedthroughholes, solder joints and thermal analysis. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Advanced PWB Materials for Surface Mounted Devices in Aerospace Applications

Microelectronics International , Volume 3 (3): 10 – Mar 1, 1986

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044249
Publisher site
See Article on Publisher Site

Abstract

Faced with LCCC growth and their widespread acceptance for military applications, Crouzet has planned a twoway approach for SMDs with MLTF multilayer thick film hybrids and advanced PWBs. This paper deals with the R&D programme carried out on both technologies. It briefly addresses MLTF interconnects under a CNES qualification programme and now being used and describes PWB R&D first investigation and screening, optimisation programme and improvement of large advanced PWB processing. Data are given on the material analysis, TCE measurements, MLB assembly, PTH platedthroughholes, solder joints and thermal analysis.

Journal

Microelectronics InternationalEmerald Publishing

Published: Mar 1, 1986

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