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Achieving optimum performance with UV curable solder masks

Achieving optimum performance with UV curable solder masks The development of UV curing technology has introduced new solder masks which will replace the thermallycured masks of the past. In doing so, processing efficiency will be increased in terms of time, energy and space saving. In considering the effective use of the new technology, thought must be given to many factors which influence the optimum performance of UV cured solder masks. The thickness of deposit will most certainly be greatly influenced by the choice of screen fabric, mesh size and squeegee which will subsequently impact upon the rate and extent of cure. One must also prepare the substrate surface adequately to compensate for the minimal wet adhesion and dwell time of a solventless ink prior to cure. Other factors such as flux chemistry, solder temperature, and soldering conditions play an important part in the performance of a solder mask and are discussed in detail. This paper was originally presented at the First Printed Circuit World Convention held at the Cafe Royal, London, in June, 1978. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Achieving optimum performance with UV curable solder masks

Circuit World , Volume 4 (4): 4 – Mar 1, 1978

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb059976
Publisher site
See Article on Publisher Site

Abstract

The development of UV curing technology has introduced new solder masks which will replace the thermallycured masks of the past. In doing so, processing efficiency will be increased in terms of time, energy and space saving. In considering the effective use of the new technology, thought must be given to many factors which influence the optimum performance of UV cured solder masks. The thickness of deposit will most certainly be greatly influenced by the choice of screen fabric, mesh size and squeegee which will subsequently impact upon the rate and extent of cure. One must also prepare the substrate surface adequately to compensate for the minimal wet adhesion and dwell time of a solventless ink prior to cure. Other factors such as flux chemistry, solder temperature, and soldering conditions play an important part in the performance of a solder mask and are discussed in detail. This paper was originally presented at the First Printed Circuit World Convention held at the Cafe Royal, London, in June, 1978.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1978

There are no references for this article.