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A Study of the Failure of Soldered SMT Joints during Thermal Cycling

A Study of the Failure of Soldered SMT Joints during Thermal Cycling An installation has been developed for carrying out thermal cycling experiments on soldered SMT joints. Using this thermal cycle installation which was developed by the authors and a simulated chip carrier, study has been made of the influence of various factors on the reliability of soldered SMT joints during thermal cycling. These factors include the position of the soldered joint, the temperature range of the thermal cycle, the dwell time, etc. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

A Study of the Failure of Soldered SMT Joints during Thermal Cycling

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037785
Publisher site
See Article on Publisher Site

Abstract

An installation has been developed for carrying out thermal cycling experiments on soldered SMT joints. Using this thermal cycle installation which was developed by the authors and a simulated chip carrier, study has been made of the influence of various factors on the reliability of soldered SMT joints during thermal cycling. These factors include the position of the soldered joint, the temperature range of the thermal cycle, the dwell time, etc.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Feb 1, 1992

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