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A Study of the Effect of Ultrasonic Cleaning on Component Quality Hybrid Devices

A Study of the Effect of Ultrasonic Cleaning on Component Quality Hybrid Devices The effect of ultrasonic agitation on hybrid devices during PCB cleaning has long been suspected as leading to device malfunction. However, little or no data exist to substantiate or quantify these effects. This paper describes a limited study into these effects using both test vehicles and commercial products, and discusses their variation with exposure time, the types and mechanisms of failure, and the rle of the hybrid package construction. It is demonstrated that the design of the hybrid package is critical in determining its susceptibility to ultrasonic damage. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

A Study of the Effect of Ultrasonic Cleaning on Component Quality Hybrid Devices

Richards, B.P.; Footner, P.K.; Burton, P.
Circuit World , Volume 19 (1): 7 – Apr 1, 1992
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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046188
Publisher site
See Article on Publisher Site

Abstract

The effect of ultrasonic agitation on hybrid devices during PCB cleaning has long been suspected as leading to device malfunction. However, little or no data exist to substantiate or quantify these effects. This paper describes a limited study into these effects using both test vehicles and commercial products, and discusses their variation with exposure time, the types and mechanisms of failure, and the rle of the hybrid package construction. It is demonstrated that the design of the hybrid package is critical in determining its susceptibility to ultrasonic damage.

Journal

Circuit World – Emerald Publishing

Published: Apr 1, 1992

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