Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of... Purpose – The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions, and further modification of the characteristics of low Ag‐content SAC solder joints using minor alloying elements to withstand both thermal cycle and drop impact loads. Design/methodology/approach – The thermal cycling and drop impact reliability of different Ag‐content SAC bulk solder will be discussed from the viewpoints of mechanical and micro‐structural properties. Findings – The best SAC composition for drop performance is not necessarily the best composition for optimum thermal cycling reliability. The content level of silver in SAC solder alloys can be an advantage or a disadvantage depending on the application, package and reliability requirements. The low Ag‐content SAC alloys with different minor alloying elements such as Mn, Ce, Bi, Ni and Ti display good performance in terms of both thermal cycling and drop impact loading conditions. Originality/value – The paper details the mechanical and micro‐structural properties requirements to design a robust bulk SAC solder joint. These properties provide design and manufacturing engineers with the necessary information when deciding on a solder alloy for their specific application. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

Download PDF
11 pages

Loading next page...
 
/lp/emerald-publishing/a-review-on-effect-of-minor-alloying-elements-on-thermal-cycling-and-94MDpLOHq6
Publisher
Emerald Publishing
Copyright
Copyright © 2012 Emerald Group Publishing Limited. All rights reserved.
ISSN
1356-5362
DOI
10.1108/13565361211219202
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions, and further modification of the characteristics of low Ag‐content SAC solder joints using minor alloying elements to withstand both thermal cycle and drop impact loads. Design/methodology/approach – The thermal cycling and drop impact reliability of different Ag‐content SAC bulk solder will be discussed from the viewpoints of mechanical and micro‐structural properties. Findings – The best SAC composition for drop performance is not necessarily the best composition for optimum thermal cycling reliability. The content level of silver in SAC solder alloys can be an advantage or a disadvantage depending on the application, package and reliability requirements. The low Ag‐content SAC alloys with different minor alloying elements such as Mn, Ce, Bi, Ni and Ti display good performance in terms of both thermal cycling and drop impact loading conditions. Originality/value – The paper details the mechanical and micro‐structural properties requirements to design a robust bulk SAC solder joint. These properties provide design and manufacturing engineers with the necessary information when deciding on a solder alloy for their specific application.

Journal

Microelectronics International – Emerald Publishing

Published: Jan 20, 2012

Keywords: Alloys; Solders; Mechanical properties of materials; Sn‐Ag‐Cu solders; Ag‐content; Minor alloying elements; Microstructure properties; Thermal cycling; Drop impact

References

  • Metallurgy Theory and Practice
    Allen, D.K.
  • High solder joint reliability with lead free solders
    Amagai, M.; Toyoda, Y.; Tajima, T.
  • Mechanical characterization of Sn‐Ag‐based lead‐free solders
    Amagai, M.; Watanabe, M.; Omiya, M.; Kishimoto, K.; Shibuya, T.
  • Effect of PCB finish on the reliability and wettability of ball grid array packages
    Bradley, E.; Banerji, K.
  • Effect of silver content and nickel dopant on mechanical properties of Sn‐Ag‐based solders
    Che, F.; Luan, J.E.; Baraton, X.
  • The study of mechanical properties of Sn‐Ag‐Cu lead‐free solders with different Ag contents and Ni doping under different strain rates and temperatures
    Che, F.X.; Zhu, W.H.; Poh, E.S.W.; Zhang, X.W.; Zhang, X.R.
  • Mechanical Metallurgy
    Dieter, G.E.
  • Mechanical Metallurgy
    Dieter, G.E.
  • Microstructural Evolution During the Thermomechanical Fatigue of Solder Joints
    Frear, D.
  • Issues related to the implementation of Pb‐free electronic solders in consumer electronics
    Frear, D.
  • A microstructural study of the thermal fatigue failures of 60Sn‐40Pb solder joints
    Frear, D.; Grivas, D.; Morris, J.W. Jr
  • Parameters affecting thermal fatigue behavior of 60Sn‐40Pb solder joints
    Frear, D.; Grivas, D.; Morris, J.W. Jr
  • Emerging reliability challenges in electronic packaging
    Frear, D.; Ramanathan, L.; Jang, J.‐W.; Owens, N.L.
  • Effect of alloying elements on properties and microstructures of SnAgCu solders
    Gao, L.; Xue, S.; Zhang, L.; Sheng, Z.; Ji, F.; Dai, W.; Yu, S.l.; Zeng, G.
  • Reliability and quality aspects of FBGA solder joints
    Grafe, J.; Garcia, R.; Labayen, M.; Grassme, O.; Ganeshan, V.; Nocke, K.; Breuer, D.; GmbH, Q.D.; Co. OHG
  • Addressing industry knowledge gaps regarding new Pb‐free solder alloy alternatives
    Henshall, G.; Healey, R.; Pandher, R.S.; Sweatman, K.; Howell, K.
  • Addressing opportunities and risks of pb‐free solder alloy alternatives
    Henshall, G.; Healey, R.; Pandher, R.S.; Sweatman, K.; Howell, K.; Coyle, R.
  • Reliability of lead free solder joint by using chip size package
    Hirano, T.; Fukuda, K.; Ito, K.; Kiga, T.; Taniguchi, Y.
  • Physical Metallurgy
    Hosford, W.F.
  • Effects of Cu, Bi and In on microstructure and tensile properties of SnAg‐X (Cu, Bi, In) solders
    Huang, M.L.; Wang, L.
  • Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn‐3.5 Ag‐X (X= Bi and Cu) solder joints
    Kariya, Y.; Hirata, Y.; Otsuka, M.
  • Effect of silver content on the shear fatigue properties of Sn‐Ag‐Cu flip‐chip interconnects
    Kariya, Y.; Hosoi, T.; Kimura, T.; Terashima, S.; Tanaka, M.; Suga, T.
  • Effects of fourth alloying additive on microstructures and tensile properties of Sn‐Ag‐Cu alloy and joints with Cu
    Kim, K.; Huh, S.; Suganuma, K.
  • Effects of intermetallic compounds on properties of Sn‐Ag‐Cu lead‐free soldered joints
    Kim, K.; Huh, S.; Suganuma, K.
  • Evaluation of high compliant low Ag solder alloys on OSP as a drop solution for the 2nd level Pb‐free interconnection
    Kim, D.; Suh, D.; Millard, T.; Kim, H.; Kumar, C.; Zhu, M.; Xu, Y.
  • Improved drop reliability performance with lead free solders of low Ag content and their failure modes
    Kim, H.; Zhang, M.; Kumar, C.; Liu, P.; Kim, D.; Xie, M.; Wang, Z.
  • Effect of SAC alloy composition on drop and temp cycle reliability of BGA with NiAu pad finish
    Kittidacha, W.; Kanjanavikat, A.; Vattananiyom, K.
  • Effect of Ni addition on bending properties of Sn‐Ag‐Cu lead‐free solder joints
    Kobayashi, T.; Kariya, Y.; Sasaki, T.; Tanaka, M.; Tatsumi, K.
  • Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders
    Lee, S.W.R.; Lui, B.H.W; Kong, Y.H.; Baylon, B.; Leung, T.; Umali, P.
  • The superior drop test performance of SAC‐Ti solders and its mechanism
    Liu, W.; Bachorik, P.; Lee, N.C.
  • Achieving high reliability low cost lead‐free SAC solder joints via Mn or Ce doping
    Liu, W.; Lee, N.C.; Bachorik, P.
  • Reliability of High‐density Lead‐free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading
    Mattila, T.
  • Impact of printed wiring board coatings on the reliability of lead‐free chip‐scale package interconnections
    Mattila, T.; Vuorinen, V.; Kivilahti, J.K.
  • Failure mechanism of solder interconnections under thermal cycling conditions
    Mattila, T.; Mueller, M.; Paulasto‐Krockel, M.; Wolter, K.‐J.
  • Experimental and thermodynamic assessment of Sn‐Ag‐Cu solder alloys
    Moon, K.W.; Boettinger, W.J.; Kattner, U.R.; Biancaniello, F.S.
  • Reliability of Pb‐free solder alloys in demanding BGA and CSP applications
    Pandher, R.; Healey, R.
  • Drop shock reliability of lead‐free alloys‐effect of micro‐additives
    Pandher, R.S.; Lewis, B.G.; Vangaveti, R.; Singh, B.
  • Drop impact analysis of Sn‐Ag‐Cu solder joints using dynamic high‐strain rate plastic strain as the impact damage driving force
    Pang, J.H.L.; Che, F.
  • Bulk solder and solder joint properties for lead free 95.5 Sn‐3.8 Ag‐0.7 Cu solder alloy
    Pang, J.H.L.; Xiong, B.S.; Neo, C.C.; Zhang, X.R.; Low, T.H.
  • Materials technology for environmentally green micro‐electronic packaging
    Renavikar, M.P.; Patel, N.; Dani, A.; Wakharkar, V.; Arrigotti, G.; Vasudevan, V.; Bchir, O.; Alur, A.P.; Gurumurthy, C.K.; Stage, R.W.
  • Mechanisms of fatigue crack propagation in metals, ceramics and composites: role of crack tip shielding
    Ritchie, R.
  • A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
    Shnawah, D.A.; Sabri, M.F.M.; Badruddin, I.A.
  • Are lead‐free solder joints reliable?
    Sohn, J.E.
  • Physical metallurgy in lead‐free electronic solder development
    Subramanian, K.; Lee, J.
  • Advances in lead‐free electronics soldering
    Suganuma, K.
  • Effects of Ag content on fracture resistance of Sn‐Ag‐Cu lead‐free solders under high‐strain rate conditions
    Suh, D.; Kim, D.W.; Liu, P.
  • Reliability and Au embrittlement of lead free solders for BGA applications
    Syed, A.
  • Alternate solder balls for improving drop/shock reliability
    Syed, A.; Kim, T.; Cha, S.
  • Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish
    Syed, A.; Kim, T.S.; Cho, Y.M.; Kim, C.W.; Yoo, M.
  • Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions
    Syed, A.; Scanlan, J.; Cha, S.; Kang, W.; Sohn, E.; Kim, T.
  • Effect of silver content on thermal fatigue life of Sn‐xAg‐0.5 Cu flip‐chip interconnects
    Terashima, S.; Kariya, Y.; Hosoi, T.
  • Improvement on thermal fatigue properties of Sn‐1.2 Ag‐0.5 Cu flip chip interconnects by nickel addition
    Terashima, S.; Kariya, Y.; Tanaka, M.
  • Improvement of thermal fatigue properties of Sn‐Ag‐Cu lead‐free solder interconnects on Casio's wafer‐level packages based on morphology and grain boundary character
    Terashima, S.; Kohno, T.; Mizusawa, A.; Arai, K.; Okada, O.; Wakabayashi, T.; Tanaka, M.; Tatsumi, K.
  • Identification of mechanical properties of intermetallic compounds on lead free solder
    Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Wu, E.; Lo, R.; Ku, T.
  • Wave soldering using Sn/3.0 Ag/0.5 Cu solder and water soluble VOC‐free flux
    Wable, G.; Chu, Q.; Damodaran, P.; Srihari, K.
  • Properties of lead‐free solder alloys with rare earth element additions
    Wu, C.; Yu, D.; Law, C.; Wang, L.
  • Microstructure investigation of Sn‐0.5 Cu‐3.5 Ag and Sn‐3.5 Ag‐0.5 Cu‐0.5 B lead‐free solders
    Ye, L.; Lai, Z.; Liu, J.; Thölén, A.
  • Improved reliability of Sn‐Ag‐Cu‐In solder alloy by the addition of minor elements
    Yu, A.; Jang, J.W.; Kim, J.‐K.; Lee, J.‐H.; Kim, M.‐S.
  • Reliability study of board‐level lead‐free interconnections under sequential thermal cycling and drop impact
    Zhang, B.; Ding, H.; Sheng, X.
  • Failure mechanism of lead‐free solder joints in flip chip packages
    Zhang, F.; Li, M.; Balakrisnan, B.; Chen, W.T.
  • Influence of Bi on microstructures evolution and mechanical properties in Sn‐Ag‐Cu lead‐free solder
    Zhao, J.; Qi, L.; Wang, X.; Wang, L.