An electronic assembly may consist of a printed circuit and various types of electrical components. Soldering to make the electricalmechanical connection is a critical process. Both printed circuit and component leads must promote acceptable solder wetting if high reliability is to be obtained. Bulk purchasing of these items can lead to long periods of storage often in poor conditions. This paper describes some of the work which simulates storage conditions by accelerated ageing so that a prediction can be made as to whether solderability will be affected. Due acknowledgement is hereby made to the EIPC for their permission to publish this paper which was presented at a recent EIPC seminar.
Circuit World – Emerald Publishing
Published: Feb 1, 1978
It’s your single place to instantly
discover and read the research
that matters to you.
Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.
All for just $49/month
Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly
Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.
Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.
Read from thousands of the leading scholarly journals from SpringerNature, Wiley-Blackwell, Oxford University Press and more.
All the latest content is available, no embargo periods.
“Hi guys, I cannot tell you how much I love this resource. Incredible. I really believe you've hit the nail on the head with this site in regards to solving the research-purchase issue.”Daniel C.
“Whoa! It’s like Spotify but for academic articles.”@Phil_Robichaud
“I must say, @deepdyve is a fabulous solution to the independent researcher's problem of #access to #information.”@deepthiw
“My last article couldn't be possible without the platform @deepdyve that makes journal papers cheaper.”@JoseServera