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A process to control diaphragm thickness with a provision for back to front alignment in the fabrication of polysilicon piezoresistive pressure sensor

A process to control diaphragm thickness with a provision for back to front alignment in the... A MEMS process is described to control diaphragm thickness with an integrated provision for back to front alignment in the fabrication of a polysilicon piezoresistive pressure sensor. The end point detection for the diaphragm etching is suitably incorporated in the process so that it is also used for the back‐to‐front alignment. The proposed process is cost‐effective and suitable for the batch fabrication of the pressure sensor. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Sensor Review Emerald Publishing

A process to control diaphragm thickness with a provision for back to front alignment in the fabrication of polysilicon piezoresistive pressure sensor

J. Akhtar; B.B. Dixit; B.D. Pant; V.P. Deshwal; B.C. Joshi
Sensor Review , Volume 23 (4): 5 – Dec 1, 2003
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References (9)

Publisher
Emerald Publishing
Copyright
Copyright © 2003 MCB UP Ltd. All rights reserved.
ISSN
0260-2288
DOI
10.1108/02602280310496827
Publisher site
See Article on Publisher Site

Abstract

A MEMS process is described to control diaphragm thickness with an integrated provision for back to front alignment in the fabrication of a polysilicon piezoresistive pressure sensor. The end point detection for the diaphragm etching is suitably incorporated in the process so that it is also used for the back‐to‐front alignment. The proposed process is cost‐effective and suitable for the batch fabrication of the pressure sensor.

Journal

Sensor Review – Emerald Publishing

Published: Dec 1, 2003

Keywords: Sensors; Microsensors; Batch manufacturing

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