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A novel copper electroplating formula for laser‐drilled micro via and through hole filling

A novel copper electroplating formula for laser‐drilled micro via and through hole filling Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

A novel copper electroplating formula for laser‐drilled micro via and through hole filling

Circuit World , Volume 30 (3): 4 – Sep 1, 2004

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Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120410520597
Publisher site
See Article on Publisher Site

Abstract

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.

Journal

Circuit WorldEmerald Publishing

Published: Sep 1, 2004

Keywords: Printed‐circuit boards; Electrodeposition

References