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- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0305-6120
- DOI
- 10.1108/03056120410520597
- Publisher site
- See Article on Publisher Site
Abstract
Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.
Journal
Circuit World – Emerald Publishing
Published: Sep 1, 2004
Keywords: Printed‐circuit boards; Electrodeposition