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A New Adhesive System for Heat Sink Bonding

A New Adhesive System for Heat Sink Bonding Current techniques for bonding thermal planes or heat sinks utilise materials and methods initially designed for other applications and so have several disadvantages. The new system described in this paper has been developed to give the optimum combination of bonding properties for this specific application. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

A New Adhesive System for Heat Sink Bonding

Circuit World , Volume 17 (2): 2 – Jan 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046122
Publisher site
See Article on Publisher Site

Abstract

Current techniques for bonding thermal planes or heat sinks utilise materials and methods initially designed for other applications and so have several disadvantages. The new system described in this paper has been developed to give the optimum combination of bonding properties for this specific application.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1991

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