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A direct‐writing approach to the micro‐patterning of copper onto polyimide

A direct‐writing approach to the micro‐patterning of copper onto polyimide Purpose – The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications. Design/methodology/approach – From a thorough literature survey, different approaches were carried out for processing polyimide. Following a design of experiments for the processing and various characterisation techniques, a micro‐coil was manufactured as a test demonstrator. Findings – The characteristics of some main formaldehyde‐based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed. Originality/value – This paper demonstrates a high‐value manufacturing technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct‐writing process have been described. The issues surrounding electroless plating on polyimide have been explained. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

A direct‐writing approach to the micro‐patterning of copper onto polyimide

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References (69)

Publisher
Emerald Publishing
Copyright
Copyright © 2009 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120910953268
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications. Design/methodology/approach – From a thorough literature survey, different approaches were carried out for processing polyimide. Following a design of experiments for the processing and various characterisation techniques, a micro‐coil was manufactured as a test demonstrator. Findings – The characteristics of some main formaldehyde‐based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed. Originality/value – This paper demonstrates a high‐value manufacturing technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct‐writing process have been described. The issues surrounding electroless plating on polyimide have been explained.

Journal

Circuit WorldEmerald Publishing

Published: May 15, 2009

Keywords: Electronic engineering; Copper; Lasers; Polymers; Metallizing

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