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A Comparison of Die Perforated Holes with Drilled Holes

A Comparison of Die Perforated Holes with Drilled Holes In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the pros and cons of die perforated and drilled holes are discussed in relation to speed of production and quality of plated-through holes, both with etched and additive printed wiring boards, single- and double-sided. A Comparison of Die Perforated Holes with Drilled Holes Edmond E. Golonsbe* INTRODUCTION to be towards the die block (usually the component side) and is subject to burrs. The clearance between the opening in the die block and the perforator becomes very critical and should be held to Die perforated holes offer the greatest economic advantage on 0 001 in. or less per side. Selection of laminate is somewhat restricted. long run commercial (non-military) type boards. There is no doubt Laminate with layers of glass fibers (G10/FR4) tend to give very that there is a distinct cost advantage in the use of die perforated rough plated holes due to the copper plating on the exposed fibres holes over drilled holes on single-sided boards where the require­ and maintaining hole sizes becomes very difficult. In wave soldering ments are 5,000 board s or more. With proper die maintenance over a the flux becomes entrapped between these plated fibres and causes million boards can be perforated when XXXP or FR2 laminates are used. The use of dies for perforating holes does not limit the making blow holes. The use of composite laminates that have similar of alterations on the printed circuit board. Hole sizes can be characteristics to G10 and FR4 improve the quality of the holes decreased or increased, and holes can be moved as needed and the considerably. Good results can be obtained with FR3, XXXP and FR2 laminates if the clearances between the perforator, the hole in addition of new holes or the elimination of holes becomes a simple the die block and the shedder are maintained. change. Although G10 or FR4 laminates can be perforated with very few problems when used for single-sided boards, various problems can be encountered on double-sided boards. New laminates with similar tensile and flexural strength to G10 and FR4 have been PUNCHE D PLATED-THROUGH HOLES developed to give holes with smooth walls suitable for the (ADDITIVE PROCESS) production of plated-through holes. The accuracy of hole locations in die perforated boards makes them suitable for the automatic Many of the problems encountered on double-sided boards with insertion of components, because several holes, slots and notches are plated-through holes are minimised or eliminated by using the perforated at one time. Indexing holes can be perforated at the same additive process. Any shape of hole and slot can be plated-through, time as the insertion holes to ensure alignment of the automation with a land only on one side, if preferred. The "lead-in" feature can equipment fixture to the holes. The repeatability of size and location now be an asset because there is no copper burr generated when in die perforated holes in board after board will allow continuous perforating as the laminate is perforated before the copper is added. insertion of components with little or no difficulty. With all component mounting holes plated, reliability of soldered joints is increased considerably. The soldered joint is formed in the Single-sided boards are perforated with the foil side towards the barrel of the hole as well as on the terminal pad. As with any perforators and the unclad side towards the die block. With a perforated holes the tools must be maintained in a satisfactory properly designed die there will be no copper burr. The need to have condition. Perforators must be kept sharp for hole smoothness and the hole in the die block larger than the perforator, causes the hole to the die block and shedder must be maintained so that cleanly cut be perforated with a "lead-in" feature. The extent of the "lead-in" holes are produced. feature can be controlled by the clearance between the perforator and hole in the die block: this can be advantageous when inserting component leads. Ther e is practically no restriction on the laminates that can be used, the author having perforated G10 laminates 3/32 in . SUMMARY thick. Holes in epoxy-glass and polyester-glass laminates will show some exposed fibres, but this will present no difficulties with With proper dies and die maintenance almost any laminate can be component insertion and soldering. Boards are produced quickly so perforated, especially single-sided boards. Perforating of double- that scheduling large quantities of boards becomes possible. Boards sided boards has been expanded by the development of "easy punch" are produced economically because of minimum maintenance and laminates that have similar characteristics to G10 or FR4. labour to produce large quantities of boards. Perforating single- and double-sided boards can mean large requirement schedules are met as from 5,000-7,000 single boards can be perforated per day with up to 1,000 holes per board. With special tooling as many as eight to twelve boards can be perforated at the PUNCHE D PLATED-THROUGH HOLES same time and this can increase the yield to 40,000-60,000 per day. (SUBTRACTIVE PROCESS) Compound dies can be made with which some or all of the holes can be perforated while the outside perimeter is being blanked out, thus Unfortunately the "lead-in" feature that is so desirable in single- maintaining hole location to the edge of the boards. The "lead-in" sided boards must also be incorporated in double-sided boards. feature can be a help in the insertion of component leads. Die Because copper is on both sides of the laminate the foil of one side has perforated holes are most suitable for single-sided boards and boards which are plated-up by the additive process. *Methode Electronics Inc. Chicago, Illinois, USA. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

A Comparison of Die Perforated Holes with Drilled Holes

Circuit World , Volume 3 (2): 1 – Jan 1, 1977

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043550
Publisher site
See Article on Publisher Site

Abstract

In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the pros and cons of die perforated and drilled holes are discussed in relation to speed of production and quality of plated-through holes, both with etched and additive printed wiring boards, single- and double-sided. A Comparison of Die Perforated Holes with Drilled Holes Edmond E. Golonsbe* INTRODUCTION to be towards the die block (usually the component side) and is subject to burrs. The clearance between the opening in the die block and the perforator becomes very critical and should be held to Die perforated holes offer the greatest economic advantage on 0 001 in. or less per side. Selection of laminate is somewhat restricted. long run commercial (non-military) type boards. There is no doubt Laminate with layers of glass fibers (G10/FR4) tend to give very that there is a distinct cost advantage in the use of die perforated rough plated holes due to the copper plating on the exposed fibres holes over drilled holes on single-sided boards where the require­ and maintaining hole sizes becomes very difficult. In wave soldering ments are 5,000 board s or more. With proper die maintenance over a the flux becomes entrapped between these plated fibres and causes million boards can be perforated when XXXP or FR2 laminates are used. The use of dies for perforating holes does not limit the making blow holes. The use of composite laminates that have similar of alterations on the printed circuit board. Hole sizes can be characteristics to G10 and FR4 improve the quality of the holes decreased or increased, and holes can be moved as needed and the considerably. Good results can be obtained with FR3, XXXP and FR2 laminates if the clearances between the perforator, the hole in addition of new holes or the elimination of holes becomes a simple the die block and the shedder are maintained. change. Although G10 or FR4 laminates can be perforated with very few problems when used for single-sided boards, various problems can be encountered on double-sided boards. New laminates with similar tensile and flexural strength to G10 and FR4 have been PUNCHE D PLATED-THROUGH HOLES developed to give holes with smooth walls suitable for the (ADDITIVE PROCESS) production of plated-through holes. The accuracy of hole locations in die perforated boards makes them suitable for the automatic Many of the problems encountered on double-sided boards with insertion of components, because several holes, slots and notches are plated-through holes are minimised or eliminated by using the perforated at one time. Indexing holes can be perforated at the same additive process. Any shape of hole and slot can be plated-through, time as the insertion holes to ensure alignment of the automation with a land only on one side, if preferred. The "lead-in" feature can equipment fixture to the holes. The repeatability of size and location now be an asset because there is no copper burr generated when in die perforated holes in board after board will allow continuous perforating as the laminate is perforated before the copper is added. insertion of components with little or no difficulty. With all component mounting holes plated, reliability of soldered joints is increased considerably. The soldered joint is formed in the Single-sided boards are perforated with the foil side towards the barrel of the hole as well as on the terminal pad. As with any perforators and the unclad side towards the die block. With a perforated holes the tools must be maintained in a satisfactory properly designed die there will be no copper burr. The need to have condition. Perforators must be kept sharp for hole smoothness and the hole in the die block larger than the perforator, causes the hole to the die block and shedder must be maintained so that cleanly cut be perforated with a "lead-in" feature. The extent of the "lead-in" holes are produced. feature can be controlled by the clearance between the perforator and hole in the die block: this can be advantageous when inserting component leads. Ther e is practically no restriction on the laminates that can be used, the author having perforated G10 laminates 3/32 in . SUMMARY thick. Holes in epoxy-glass and polyester-glass laminates will show some exposed fibres, but this will present no difficulties with With proper dies and die maintenance almost any laminate can be component insertion and soldering. Boards are produced quickly so perforated, especially single-sided boards. Perforating of double- that scheduling large quantities of boards becomes possible. Boards sided boards has been expanded by the development of "easy punch" are produced economically because of minimum maintenance and laminates that have similar characteristics to G10 or FR4. labour to produce large quantities of boards. Perforating single- and double-sided boards can mean large requirement schedules are met as from 5,000-7,000 single boards can be perforated per day with up to 1,000 holes per board. With special tooling as many as eight to twelve boards can be perforated at the PUNCHE D PLATED-THROUGH HOLES same time and this can increase the yield to 40,000-60,000 per day. (SUBTRACTIVE PROCESS) Compound dies can be made with which some or all of the holes can be perforated while the outside perimeter is being blanked out, thus Unfortunately the "lead-in" feature that is so desirable in single- maintaining hole location to the edge of the boards. The "lead-in" sided boards must also be incorporated in double-sided boards. feature can be a help in the insertion of component leads. Die Because copper is on both sides of the laminate the foil of one side has perforated holes are most suitable for single-sided boards and boards which are plated-up by the additive process. *Methode Electronics Inc. Chicago, Illinois, USA.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1977

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