A binocular machine vision system for ball grid array package inspection

A binocular machine vision system for ball grid array package inspection Purpose – In this paper, an optical inspection method of the ball grid array package(BGA) is proposed using a binocular machine vision system. Design/methodology/approach – The height of each solder ball is calculated based on spatial geometrical size and location obtained from the two CCD cameras capturing range images of a LED illuminated BGA chip at certain orientation. Findings – The structure of this system is simple and the accuracy is 0.02 mm, The experimental results have proved the validity of this system for BGA failure detection. Practical implications – The developed machine vision system can provide some of the critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. Originality/value – Compared with other systems, the structure of this system is simple and accurate, which meets the demand of off‐line and on‐line inspection. The limitation of this system is that the margin of field of view (FOV) is fuzzy. Further study could be focused on this problem. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Assembly Automation Emerald Publishing

A binocular machine vision system for ball grid array package inspection

Assembly Automation, Volume 25 (3): 6 – Sep 1, 2005

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Publisher
Emerald Publishing
Copyright
Copyright © 2005 Emerald Group Publishing Limited. All rights reserved.
ISSN
0144-5154
DOI
10.1108/01445150510610935
Publisher site
See Article on Publisher Site

Abstract

Purpose – In this paper, an optical inspection method of the ball grid array package(BGA) is proposed using a binocular machine vision system. Design/methodology/approach – The height of each solder ball is calculated based on spatial geometrical size and location obtained from the two CCD cameras capturing range images of a LED illuminated BGA chip at certain orientation. Findings – The structure of this system is simple and the accuracy is 0.02 mm, The experimental results have proved the validity of this system for BGA failure detection. Practical implications – The developed machine vision system can provide some of the critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. Originality/value – Compared with other systems, the structure of this system is simple and accurate, which meets the demand of off‐line and on‐line inspection. The limitation of this system is that the margin of field of view (FOV) is fuzzy. Further study could be focused on this problem.

Journal

Assembly AutomationEmerald Publishing

Published: Sep 1, 2005

Keywords: Image processing; Inspection; Printed circuits

References

  • Locating and checking of a BGA Pin's position using gray level
    Ruo, C.‐W.; Shih, C.‐L.
  • High‐speed optical three‐dimensional scanner for automatic solder joint inspection
    Schneider, R.; Schick, A.

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