•Correlations are proposed to calculate the temperature on electronic assemblies.•Four QFN electronic packages are considered: QFN16, QFN32, QFN16b and QFN32b.•The power generated by the active devices ranges between 0W (device off) and 1W.•The inclination angle of the Printed Circuit Board and QFN varies between 0° and 90°.•The correlations easy to use helps improving the QFN thermal design and reliability.
Applied Thermal Engineering – Elsevier
Published: Jun 5, 2016
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