1 Introduction</h5> To solve transient heat conduction problems two material properties, volumetric heat capacity and thermal conductivity, have to be known. These properties have a significant temperature dependency in case of several materials. Determination of these properties by the well-known measurement methods needs one or in some cases two measurement devices. Measurement of the temperature dependency (especially in case of the thermal conductivity) usually requires repeated measurements at several temperature levels which might be time-consuming (e.g., hot wire method  , laser flash method  , hot ball method  , hot disc method  ). Simultaneous measurement of the two material properties with direct determination of the temperature dependency of the properties could make the measurements easier, faster and cheaper. The BICOND 1 BI refers to the fact that the method is designed to measure both the volumetric heat capacity and the thermal conductivity. COND simply refers to heat conduction. 1 thermophysical property measurement method proposed by Kiss  (the BICOND method is summarized in  ) was designed for the former task. Although the measurement is easier, the evaluation of the material properties from the measured temperature histories needs the solution of a challenging inverse heat
International Journal of Heat and Mass Transfer – Elsevier
Published: Jan 1, 2014
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