•Nickel iron coated copper thin films were prepared using pulse electrodeposition under an ultrasonic field.•Careful investigation was performed on the effect of different current magnitudes, deposition times and ultrasonic bath temperatures on the NiFe films.•The effect of the preparation conditions on surface morphology, surface roughness and electrical resistivity of the NiFe thin films were examined.•NiFe/Cu thin films with significant reduction in grain size, surface roughness and electrical resistivity were achieved.
Applied Surface Science – Elsevier
Published: Jan 1, 2016
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