Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition

Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse... •Nickel iron coated copper thin films were prepared using pulse electrodeposition under an ultrasonic field.•Careful investigation was performed on the effect of different current magnitudes, deposition times and ultrasonic bath temperatures on the NiFe films.•The effect of the preparation conditions on surface morphology, surface roughness and electrical resistivity of the NiFe thin films were examined.•NiFe/Cu thin films with significant reduction in grain size, surface roughness and electrical resistivity were achieved. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Applied Surface Science Elsevier

Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition

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Publisher
Elsevier
Copyright
Copyright © 2015 Elsevier B.V.
ISSN
0169-4332
eISSN
1873-5584
D.O.I.
10.1016/j.apsusc.2015.10.181
Publisher site
See Article on Publisher Site

Abstract

•Nickel iron coated copper thin films were prepared using pulse electrodeposition under an ultrasonic field.•Careful investigation was performed on the effect of different current magnitudes, deposition times and ultrasonic bath temperatures on the NiFe films.•The effect of the preparation conditions on surface morphology, surface roughness and electrical resistivity of the NiFe thin films were examined.•NiFe/Cu thin films with significant reduction in grain size, surface roughness and electrical resistivity were achieved.

Journal

Applied Surface ScienceElsevier

Published: Jan 1, 2016

References

  • Pulsed electrodeposition of microcrystalline chromium from trivalent Cr-DMF bath
    Saravanan, G.; Mohan, S.
  • Influence of the electrodeposition parameters on surface morphology and local magnetic properties of thin iron layers
    Jartych, E.; Jalochowski, M.; Budzynski, M.

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