New tools for yield improvement in integrated circuit manufacturing: can they be applied to reliability?

New tools for yield improvement in integrated circuit manufacturing: can they be applied to... This paper will start with a discussion of why probe yield (the number of good chips per silicon wafer) is so important to financial success in integrated circuit manufacturing. Actual data will be quoted and a numerical example shown. A simple model will be given to demonstrate the main factors influencing yield and the relationship between yield and reliability of the final product. In the last few years a range of new tools have been deployed in manufacturing, and these have accelerated the pace of yield improvement, thus increasing competitive pressures. These tools will be described, along with examples of their use. Topics will include in-line inspection and control, automatic defect classification and data mining techniques. A proposal is made to extend these tools to the improvement of reliability of products already in manufacturing by maintaining absolute chip identity throughout the entire wafer fabrication, packaging and final testing steps. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics Reliability Elsevier

New tools for yield improvement in integrated circuit manufacturing: can they be applied to reliability?

Microelectronics Reliability, Volume 39 (6) – Jun 1, 1999

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Publisher
Elsevier
Copyright
Copyright © 1999 Elsevier Ltd
ISSN
0026-2714
eISSN
1872-941X
DOI
10.1016/S0026-2714(99)00094-3
Publisher site
See Article on Publisher Site

Abstract

This paper will start with a discussion of why probe yield (the number of good chips per silicon wafer) is so important to financial success in integrated circuit manufacturing. Actual data will be quoted and a numerical example shown. A simple model will be given to demonstrate the main factors influencing yield and the relationship between yield and reliability of the final product. In the last few years a range of new tools have been deployed in manufacturing, and these have accelerated the pace of yield improvement, thus increasing competitive pressures. These tools will be described, along with examples of their use. Topics will include in-line inspection and control, automatic defect classification and data mining techniques. A proposal is made to extend these tools to the improvement of reliability of products already in manufacturing by maintaining absolute chip identity throughout the entire wafer fabrication, packaging and final testing steps.

Journal

Microelectronics ReliabilityElsevier

Published: Jun 1, 1999

References

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