Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics... To improve the reliability of the power electronic modules for the high temperature applications, an innovative Thermal Bridge Composite (i-TBC) was designed. It has the architectured structure consisting of perforated FeNi36 sheet inserted between two Cu sheets. Due to simultaneous use of Cu and FeNi36, i-TBC possesses both a good thermal transverse conductivity and a limited longitudinal coefficient of thermal expansion. Different characterisations of i-TBC are required to understand the formation of its microstructure leading to the final properties. Therefore, the aim of this study was to analyse the integrity of Cu-Cu and Cu-FeNi36 interfaces as well as copper microstructure evolution throughout all elaboration steps: (i) first cold rolling, (ii) heat treatment and (iii) second cold rolling. First cold rolling did not lead to a bonding of Cu-Cu interfaces in the thermal bridge. Moreover, heterogeneity of Cu grain microstructure was observed with formation of ultra-fine grained structure close to junctions of Cu and FeNi36. The heat treatment led to a degradation of different interfaces adherence and to a complete copper recrystallization. Finally, the second cold rolling ensured an efficient solid welding of Cu-Cu interfaces and led to a heterogeneity of strain hardening of copper. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Materials & design Elsevier

Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

Loading next page...
 
/lp/elsevier/microstructure-evolution-of-innovative-thermal-bridge-composite-i-tbc-0yxkRNC7ZF
Publisher
Elsevier
Copyright
Copyright © 2017 Elsevier Ltd
ISSN
0264-1275
eISSN
0141-5530
D.O.I.
10.1016/j.matdes.2017.10.009
Publisher site
See Article on Publisher Site

Abstract

To improve the reliability of the power electronic modules for the high temperature applications, an innovative Thermal Bridge Composite (i-TBC) was designed. It has the architectured structure consisting of perforated FeNi36 sheet inserted between two Cu sheets. Due to simultaneous use of Cu and FeNi36, i-TBC possesses both a good thermal transverse conductivity and a limited longitudinal coefficient of thermal expansion. Different characterisations of i-TBC are required to understand the formation of its microstructure leading to the final properties. Therefore, the aim of this study was to analyse the integrity of Cu-Cu and Cu-FeNi36 interfaces as well as copper microstructure evolution throughout all elaboration steps: (i) first cold rolling, (ii) heat treatment and (iii) second cold rolling. First cold rolling did not lead to a bonding of Cu-Cu interfaces in the thermal bridge. Moreover, heterogeneity of Cu grain microstructure was observed with formation of ultra-fine grained structure close to junctions of Cu and FeNi36. The heat treatment led to a degradation of different interfaces adherence and to a complete copper recrystallization. Finally, the second cold rolling ensured an efficient solid welding of Cu-Cu interfaces and led to a heterogeneity of strain hardening of copper.

Journal

Materials & designElsevier

Published: Jan 5, 2018

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Search

Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly

Organize

Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.

Access

Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve

Freelancer

DeepDyve

Pro

Price

FREE

$49/month
$360/year

Save searches from
Google Scholar,
PubMed

Create lists to
organize your research

Export lists, citations

Read DeepDyve articles

Abstract access only

Unlimited access to over
18 million full-text articles

Print

20 pages / month

PDF Discount

20% off