Improvement of NiMoNb to polyimide adhesion by inductively coupled nitrogen plasma treatment

Improvement of NiMoNb to polyimide adhesion by inductively coupled nitrogen plasma treatment Article history: In this study, the effect of sputtering power on the peel strength of the flexible copper clad laminate Received 7 September 2015 (FCCL) was evaluated before and after heat treatment using 180 peel test. An increase in the sputtering Received in revised form 22 October 2015 powers from 200 W to 600 W increased film density and improved peel strength. To enhance peel strength Accepted 27 October 2015 much more, an inductively coupled plasma (ICP) was treated on the PI surface using N gas with Ar as Available online 30 October 2015 a function of RF power. A dramatic enhancement of the peel strength, 923 N/m was achieved, especially after heat treatment by changing ICP power from 200 W to 900 W. The reduction ratio of the peel strength Keywords: for the 900 W plasma-treated FCCL was only 12%, whereas that for the 200 W plasma-treated FCCL was NiMoNb 43%. The root mean square (RMS) surface roughness with PIs exposed to both 200 W and 900 W plasma Peel strength treatments was rarely changed, while X-ray photoelectron spectroscopy (XPS) showed the substantial ICP treatment increase of C–N functional groups. To obtain insight the film characteristics, the NiMoNb/PI http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Applied Surface Science Elsevier

Improvement of NiMoNb to polyimide adhesion by inductively coupled nitrogen plasma treatment

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Publisher
Elsevier
Copyright
Copyright © 2015 Elsevier B.V.
ISSN
0169-4332
eISSN
1873-5584
D.O.I.
10.1016/j.apsusc.2015.10.202
Publisher site
See Article on Publisher Site

Abstract

Article history: In this study, the effect of sputtering power on the peel strength of the flexible copper clad laminate Received 7 September 2015 (FCCL) was evaluated before and after heat treatment using 180 peel test. An increase in the sputtering Received in revised form 22 October 2015 powers from 200 W to 600 W increased film density and improved peel strength. To enhance peel strength Accepted 27 October 2015 much more, an inductively coupled plasma (ICP) was treated on the PI surface using N gas with Ar as Available online 30 October 2015 a function of RF power. A dramatic enhancement of the peel strength, 923 N/m was achieved, especially after heat treatment by changing ICP power from 200 W to 900 W. The reduction ratio of the peel strength Keywords: for the 900 W plasma-treated FCCL was only 12%, whereas that for the 200 W plasma-treated FCCL was NiMoNb 43%. The root mean square (RMS) surface roughness with PIs exposed to both 200 W and 900 W plasma Peel strength treatments was rarely changed, while X-ray photoelectron spectroscopy (XPS) showed the substantial ICP treatment increase of C–N functional groups. To obtain insight the film characteristics, the NiMoNb/PI

Journal

Applied Surface ScienceElsevier

Published: Jan 1, 2016

References

  • Microelectron. Eng.
    Noh, B.-I.; Yoon, J.-W.; Jung, S.-B.

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