Article history: In this study, the effect of sputtering power on the peel strength of the ﬂexible copper clad laminate Received 7 September 2015 (FCCL) was evaluated before and after heat treatment using 180 peel test. An increase in the sputtering Received in revised form 22 October 2015 powers from 200 W to 600 W increased ﬁlm density and improved peel strength. To enhance peel strength Accepted 27 October 2015 much more, an inductively coupled plasma (ICP) was treated on the PI surface using N gas with Ar as Available online 30 October 2015 a function of RF power. A dramatic enhancement of the peel strength, 923 N/m was achieved, especially after heat treatment by changing ICP power from 200 W to 900 W. The reduction ratio of the peel strength Keywords: for the 900 W plasma-treated FCCL was only 12%, whereas that for the 200 W plasma-treated FCCL was NiMoNb 43%. The root mean square (RMS) surface roughness with PIs exposed to both 200 W and 900 W plasma Peel strength treatments was rarely changed, while X-ray photoelectron spectroscopy (XPS) showed the substantial ICP treatment increase of C–N functional groups. To obtain insight the ﬁlm characteristics, the NiMoNb/PI
Applied Surface Science – Elsevier
Published: Jan 1, 2016
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