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Flip-chip packaging solution for CMOS image sensor device

Chip scaled opto-electronic packaging is introduced as a cost and size effective packaging solution for mobile phone with built in camera. The chip scaled assembly includes gold bumped CMOS image sensor device and its flip-chip bonding on substrate using the anisotropic conductive material. Two types of flip-chip module were designed to have flip-chip on flex and flip-chip on glass. It is shown that well controlled bumping process of thin film deposition and wet etching gives no damage to image sensing surface during the deposition and stripping of metal film. As results, smart and high degree miniaturized image sensor module is actualized for mobile phone and the reliability test results proved the robustness of module structure having flip-chip. Solder bumping was also reviewed and successfully introduced to verify the alternative of image sensor bumping. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics Reliability Elsevier
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