Experimental investigation of inserts configurations and PCM type on the thermal performance of PCM based heat sinks

Experimental investigation of inserts configurations and PCM type on the thermal performance of... Nomenclature</h5> Abbreviation</h5> PCM Phase Change Material</P>SC single cavity</P>Symbols</h5> Cp specific heat capacity (J kg −1 K −1 )</P>H height (mm)</P>k thermal conductivity (Wm −1 K −1 )</P>L length (mm)</P>N number of cavities</P>W width (mm)</P>Δ H latent heat of melting of PCM (kJ kg −1 )</P>T Melt melting temperature (°C)</P>ρ density (kg m −3 )</P>1 Introduction</h5> High demand for more installed functions in portable electronic devices requires higher power inputs which leads to higher devices operating temperatures. Therefore it is necessary to develop effective thermal management techniques to ensure sufficiently low operating temperatures for reliability, durability and user comfort. Based on the materials used, portable device cases of temperatures higher than 45 °C could cause discomfort to users [1] . A number of factors influence the choice of cooling methodology used including: space, operating environment, heat dissipated, cost of materials and maintenance required [2] . The use of active thermal methods such as miniature centrifugal fans proved to be inefficient due to space, noise levels, high maintenance and additional power consumption [3] .</P>Phase Changing Material (PCM) utilizes the latent heat of fusion which is the thermal energy absorbed during the melting process at a constant temperature to generate the http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Applied Energy Elsevier

Experimental investigation of inserts configurations and PCM type on the thermal performance of PCM based heat sinks

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Publisher
Elsevier
Copyright
Copyright © 2013 Elsevier Ltd
ISSN
0306-2619
D.O.I.
10.1016/j.apenergy.2013.04.059
Publisher site
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Abstract

Nomenclature</h5> Abbreviation</h5> PCM Phase Change Material</P>SC single cavity</P>Symbols</h5> Cp specific heat capacity (J kg −1 K −1 )</P>H height (mm)</P>k thermal conductivity (Wm −1 K −1 )</P>L length (mm)</P>N number of cavities</P>W width (mm)</P>Δ H latent heat of melting of PCM (kJ kg −1 )</P>T Melt melting temperature (°C)</P>ρ density (kg m −3 )</P>1 Introduction</h5> High demand for more installed functions in portable electronic devices requires higher power inputs which leads to higher devices operating temperatures. Therefore it is necessary to develop effective thermal management techniques to ensure sufficiently low operating temperatures for reliability, durability and user comfort. Based on the materials used, portable device cases of temperatures higher than 45 °C could cause discomfort to users [1] . A number of factors influence the choice of cooling methodology used including: space, operating environment, heat dissipated, cost of materials and maintenance required [2] . The use of active thermal methods such as miniature centrifugal fans proved to be inefficient due to space, noise levels, high maintenance and additional power consumption [3] .</P>Phase Changing Material (PCM) utilizes the latent heat of fusion which is the thermal energy absorbed during the melting process at a constant temperature to generate the

Journal

Applied EnergyElsevier

Published: Dec 1, 2013

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