Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point

Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's... •Direct diffusion bonding method is a feasible way to construct a metallurgical bonding interface between immiscible W and Cu.•The key point of the direct diffusion bonding is that bonding temperatures should be close to copper's melting point.•The maximum tensile and bending strengths of the obtained W/Cu joints are about 172MPa and 232MPa, respectively.•A diffusion occurs between W and Cu and the thickness of the W/Cu diffusion layer is about 22nm. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Materials & design Elsevier

Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point

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Publisher
Elsevier
Copyright
Copyright © 2017 Elsevier Ltd
ISSN
0264-1275
eISSN
0141-5530
D.O.I.
10.1016/j.matdes.2017.10.052
Publisher site
See Article on Publisher Site

Abstract

•Direct diffusion bonding method is a feasible way to construct a metallurgical bonding interface between immiscible W and Cu.•The key point of the direct diffusion bonding is that bonding temperatures should be close to copper's melting point.•The maximum tensile and bending strengths of the obtained W/Cu joints are about 172MPa and 232MPa, respectively.•A diffusion occurs between W and Cu and the thickness of the W/Cu diffusion layer is about 22nm.

Journal

Materials & designElsevier

Published: Jan 5, 2018

References

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