•Direct diffusion bonding method is a feasible way to construct a metallurgical bonding interface between immiscible W and Cu.•The key point of the direct diffusion bonding is that bonding temperatures should be close to copper's melting point.•The maximum tensile and bending strengths of the obtained W/Cu joints are about 172MPa and 232MPa, respectively.•A diffusion occurs between W and Cu and the thickness of the W/Cu diffusion layer is about 22nm.
Materials & design – Elsevier
Published: Jan 5, 2018
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