Development and adhesion characterization of a silicon wafer for temporary bonding

Development and adhesion characterization of a silicon wafer for temporary bonding The development of a silicon temporary carrier for thin wafer handling for 3D applications was investigated. Process selection and optimization ended up with a silicon carrier entirely covered with an antistick layer based on a fluorinated polymer. The carrier preparation was quite easy because only one coating was used and no sticking edge zone was needed onto the carrier. The fluorinated coating led to a very hydrophobic behavior. When bonded with a thermoplastic glue, it also exhibited very antiadhesive properties because the adherence was as low as 0.4J/m2 and lower than the adherence of a stack without any antiadhesive layer (above 4J/m2). The carrier was nevertheless suitable for different back side processes in 300mm: grinding, chemical cleaning, chemical mechanical polishing and silicon oxide deposition. Compared with a commercial carrier, it exhibited the same level of performance for the integration. The proposed carrier was compatible with a mechanical debonding of a thinned bonded structure with a silicon device wafer of 80µm. The carrier recycling was possible without any new preparation. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png International Journal of Adhesion and Adhesives Elsevier

Development and adhesion characterization of a silicon wafer for temporary bonding

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Publisher
Elsevier
Copyright
Copyright © 2018 Elsevier Ltd
ISSN
0143-7496
D.O.I.
10.1016/j.ijadhadh.2018.01.007
Publisher site
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Abstract

The development of a silicon temporary carrier for thin wafer handling for 3D applications was investigated. Process selection and optimization ended up with a silicon carrier entirely covered with an antistick layer based on a fluorinated polymer. The carrier preparation was quite easy because only one coating was used and no sticking edge zone was needed onto the carrier. The fluorinated coating led to a very hydrophobic behavior. When bonded with a thermoplastic glue, it also exhibited very antiadhesive properties because the adherence was as low as 0.4J/m2 and lower than the adherence of a stack without any antiadhesive layer (above 4J/m2). The carrier was nevertheless suitable for different back side processes in 300mm: grinding, chemical cleaning, chemical mechanical polishing and silicon oxide deposition. Compared with a commercial carrier, it exhibited the same level of performance for the integration. The proposed carrier was compatible with a mechanical debonding of a thinned bonded structure with a silicon device wafer of 80µm. The carrier recycling was possible without any new preparation.

Journal

International Journal of Adhesion and AdhesivesElsevier

Published: Apr 1, 2018

References

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