Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of... Lapping for sapphire substrates was evaluated with respect to material removal modes. Firstly, a 3-body removal mode that consists of diamond slurry and a metal–resin platen was tested. The metal–resin platen was produced by mixing metal particles (Cu, Al, and Sn) and resin. Secondly, we analyzed a 2-body system using a fixed diamond abrasive pad with a low concentration of alumina slurry as a dressing for the pad surface. For each lapping process, we examined the function of the diamond abrasive particles. The fundamental characteristics of each process were observed to suggest optimal conditions for sapphire processing for various applications. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Wear Elsevier

Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

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Publisher
Elsevier
Copyright
Copyright © 2015 Elsevier B.V.
ISSN
0043-1648
eISSN
1873-2577
D.O.I.
10.1016/j.wear.2015.02.029
Publisher site
See Article on Publisher Site

Abstract

Lapping for sapphire substrates was evaluated with respect to material removal modes. Firstly, a 3-body removal mode that consists of diamond slurry and a metal–resin platen was tested. The metal–resin platen was produced by mixing metal particles (Cu, Al, and Sn) and resin. Secondly, we analyzed a 2-body system using a fixed diamond abrasive pad with a low concentration of alumina slurry as a dressing for the pad surface. For each lapping process, we examined the function of the diamond abrasive particles. The fundamental characteristics of each process were observed to suggest optimal conditions for sapphire processing for various applications.

Journal

WearElsevier

Published: May 1, 2015

References

  • GaN micro-light-emitting diode arrays with monolithically integrated sapphire microlenses
    Choi, H.W.; Liu, C.; Gu, E.; McConnell, G.; Girkin, J.M.; Watson, I.M.; Dawson, M.D.
  • Study on sapphire removal for thin-film LEDs fabrication using CMP and dry etching
    Zhou, S.; Liu, S.
  • Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate
    Xu, W.; Lu, X.; Pan, G.; Lei, Y.; Luo, J.
  • Highly accurate flatness and parallelism in the manufacture of thin sapphire flat lenses
    Chang, R.S.; Chern, D.C.
  • Optical polishing of metals
    Brown, N.J.; Baker, P.C.; Maney, R.T.

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