Analytical optimal design of thermoelectric heat pumps

Analytical optimal design of thermoelectric heat pumps Nomenclature</h5> Symbols</h5> COP Coefficient of performance -</P>I Electric current A</P>K Thermal conductance W K −1 </P>L Leg length M</P>M Factor -</P>N Number of legs -</P>P Electrical power W</P>Q Hot or cold thermal power W</P>R Electrical resistance Ω</P>S Leg section m 2 </P>T Temperature K</P>U Voltage V</P>V Thermoelectric material volume m 3 </P>Z Figure of merit K −1 </P>Greek Symbols</h5> α Seebeck coefficient V K −1 </P>λ Thermal conductivity W m −1 K −1 </P>ρ Electrical resistivity Ω m</P>τ Thomson coefficient V K −1 </P>Subscripts</h5> m mean value</P>eq equivalent</P>C cold side</P>H hot side</P>L refers to the leg</P>Overscripts</h5> TOT refers to THP</P>* optimal value</P>1 Introduction</h5> Thermoelectric phenomena were discovered at the end of 19th century by Seebeck [1] , Peltier [2] and Thomson [3] . The Peltier effect, occurring when an electrical current is applied to semi-conductors, leads to heat adsorption on the cold side and heat release on the hot side. Based on this effect, thermoelectric heat pumps (THPs) are increasingly used for heating and cooling applications. These thermoelectric devices are generally used when the target applications impose minimum space, noise, weight or an environment with substantial mechanical constraints. Therefore, many applications have been developed in electronics [4,5] for http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Applied Thermal Engineering Elsevier

Analytical optimal design of thermoelectric heat pumps

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Publisher
Elsevier
Copyright
Copyright © 2015 Elsevier Ltd
ISSN
1359-4311
eISSN
1873-5606
D.O.I.
10.1016/j.applthermaleng.2015.02.042
Publisher site
See Article on Publisher Site

Abstract

Nomenclature</h5> Symbols</h5> COP Coefficient of performance -</P>I Electric current A</P>K Thermal conductance W K −1 </P>L Leg length M</P>M Factor -</P>N Number of legs -</P>P Electrical power W</P>Q Hot or cold thermal power W</P>R Electrical resistance Ω</P>S Leg section m 2 </P>T Temperature K</P>U Voltage V</P>V Thermoelectric material volume m 3 </P>Z Figure of merit K −1 </P>Greek Symbols</h5> α Seebeck coefficient V K −1 </P>λ Thermal conductivity W m −1 K −1 </P>ρ Electrical resistivity Ω m</P>τ Thomson coefficient V K −1 </P>Subscripts</h5> m mean value</P>eq equivalent</P>C cold side</P>H hot side</P>L refers to the leg</P>Overscripts</h5> TOT refers to THP</P>* optimal value</P>1 Introduction</h5> Thermoelectric phenomena were discovered at the end of 19th century by Seebeck [1] , Peltier [2] and Thomson [3] . The Peltier effect, occurring when an electrical current is applied to semi-conductors, leads to heat adsorption on the cold side and heat release on the hot side. Based on this effect, thermoelectric heat pumps (THPs) are increasingly used for heating and cooling applications. These thermoelectric devices are generally used when the target applications impose minimum space, noise, weight or an environment with substantial mechanical constraints. Therefore, many applications have been developed in electronics [4,5] for

Journal

Applied Thermal EngineeringElsevier

Published: May 5, 2015

References

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