In this work, an analytical model for adhesive die-attaching under thermal loads is proposed. The second-order beam theory is employed to model the die and substrate, so the shearing deformations can be evaluated more accurately comparing to models based on the Timoshenko beam theory and interface compliance. Then, governing equations are solved by Fourier series with the elastic foundation for the adhesive layer. As such, numerical calculations for eigenvalues are avoided, and explicit closed-form solutions are obtained. Based on the analytical model, effects of material properties and dimensions on the thermal deformation in the die are discussed. In the die, the longitudinal expansion and transverse warpage induced by thermal deformation both decrease with decreasing Young's modulus of adhesive. The longitudinal expansion decreases with increasing die thickness. However, the transverse warpage increases with increasing die thickness.
International Journal of Adhesion and Adhesives – Elsevier
Published: Apr 1, 2018
It’s your single place to instantly
discover and read the research
that matters to you.
Enjoy affordable access to
over 12 million articles from more than
10,000 peer-reviewed journals.
All for just $49/month
Read as many articles as you need. Full articles with original layout, charts and figures. Read online, from anywhere.
Keep up with your field with Personalized Recommendations and Follow Journals to get automatic updates.
It’s easy to organize your research with our built-in tools.
Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.
All the latest content is available, no embargo periods.
“Hi guys, I cannot tell you how much I love this resource. Incredible. I really believe you've hit the nail on the head with this site in regards to solving the research-purchase issue.”Daniel C.
“Whoa! It’s like Spotify but for academic articles.”@Phil_Robichaud
“I must say, @deepdyve is a fabulous solution to the independent researcher's problem of #access to #information.”@deepthiw
“My last article couldn't be possible without the platform @deepdyve that makes journal papers cheaper.”@JoseServera