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High-speed optical three-dimensional scanner for automatic solder joint inspection

High-speed optical three-dimensional scanner for automatic solder joint inspection The optical principle of a high-speed three-dimensional scanner that can operate at high and medium resolution was developed on the basis of confocal microscopy. It was shown that 3-D detection of surfaces, essentially independent of surface characteristics such as inclination and reflectivity, is feasible. Shading effects were found to be negligible. A data rate of 2 Mpixel/s and a 3-D resolution of 5 to 15 ॖm at 150-ॖm to 1.5-mm height range were achieved. In a factory a high-resolution scanner has been operating successfully for automatic solder joint inspection of multichip modules since 1994. Also, a medium-resolution system for solder joint inspection of surface-mounted devices was developed and evaluated. In view of their high inspection reliability, the developed 3-D inspection systems promise to be a powerful tool for use in production lines. © 1997 Society of Photo-Optical Instrumentation Engineers. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Optical Engineering SPIE

High-speed optical three-dimensional scanner for automatic solder joint inspection

Optical Engineering , Volume 36 (10) – Oct 1, 1997

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Publisher
SPIE
Copyright
Copyright © 1997 Society of Photo-Optical Instrumentation Engineers
ISSN
0091-3286
eISSN
1560-2303
DOI
10.1117/1.601412
Publisher site
See Article on Publisher Site

Abstract

The optical principle of a high-speed three-dimensional scanner that can operate at high and medium resolution was developed on the basis of confocal microscopy. It was shown that 3-D detection of surfaces, essentially independent of surface characteristics such as inclination and reflectivity, is feasible. Shading effects were found to be negligible. A data rate of 2 Mpixel/s and a 3-D resolution of 5 to 15 ॖm at 150-ॖm to 1.5-mm height range were achieved. In a factory a high-resolution scanner has been operating successfully for automatic solder joint inspection of multichip modules since 1994. Also, a medium-resolution system for solder joint inspection of surface-mounted devices was developed and evaluated. In view of their high inspection reliability, the developed 3-D inspection systems promise to be a powerful tool for use in production lines. © 1997 Society of Photo-Optical Instrumentation Engineers.

Journal

Optical EngineeringSPIE

Published: Oct 1, 1997

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