Access the full text.
Sign up today, get DeepDyve free for 14 days.
J. Park, Jeong Chae, Il Park, H. Youn, Y. Moon (2007)
Thermo-Mechanical Stresses and Mechanical Reliability of Multilayer Ceramic Capacitors (MLCC)Journal of the American Ceramic Society, 90
Klaus Franken, H. Maier, K. Prume, R. Waser (2004)
Finite‐Element Analysis of Ceramic Multilayer Capacitors: Failure Probability Caused by Wave Soldering and Bending LoadsJournal of the American Ceramic Society, 83
Gang Yang, Zhenxing Yue, Tieyu Sun, W. Jiang, Xiang Li, Longtu Li (2008)
Evaluation of Residual Stress in a Multilayer Ceramic Capacitor and its Effect on Dielectric Behaviors Under Applied dc Bias FieldJournal of the American Ceramic Society, 91
W. Jiang, Xi-Qiao Feng, C. Nan (2008)
A three-dimensional theoretical model for estimating the thermal residual stresses in micro multilayer ceramic capacitorsComposites Science and Technology, 68
L. Vu-Quoc, V. Srinivas, Y. Zhai (2003)
Finite element analysis of advanced multilayer capacitorsInternational Journal for Numerical Methods in Engineering, 58
Y. Shin, Kyung-Moo Kang, Yeon‐Gil Jung, J. Yeo, Sang-Gyu Lee, U. Paik (2003)
Internal stresses in BaTiO3/Ni MLCCsJournal of The European Ceramic Society, 23
W. Jiang, Xi-Qiao Feng, C. Nan (2008)
Influence of residual thermal stresses and geometric parameters on stress and electric fields in multilayer ceramic capacitors under electric biasJournal of Physics D: Applied Physics, 41
K. Prume, R. Waser, Klaus Franken, H. Maier (2004)
Finite‐Element Analysis of Ceramic Multilayer Capacitors: Modeling and Electrical Impedance Spectroscopy for a Nondestructive Failure TestJournal of the American Ceramic Society, 83
M. Keimasi, M. Azarian, M. Pecht (2007)
Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminationsMicroelectron. Reliab., 47
Jong-Sung Park, Hyunho Shin, K. Hong, H. Jung, Jung‐Kun Lee, K. Rhee (2006)
Effect of margin widths on the residual stress in a multi-layer ceramic capacitorMicroelectronic Engineering, 83
Weihua Jiang, Xi-Qiao Feng, G. Yang, Zhenxing Yue, C. Nan (2007)
Influence of thickness and number of dielectric layers on residual stresses in micromultilayer ceramic capacitorsJournal of Applied Physics, 101
Hyunho Shin, Jong-Sung Park, K. Hong, H. Jung, Jung‐Kun Lee, K. Rhee (2007)
Physical origin of residual thermal stresses in a multilayer ceramic capacitorJournal of Applied Physics, 101
Chun-Hway Hsueh, M. Ferber (2002)
Apparent coefficient of thermal expansion and residual stresses in multilayer capacitorsComposites Part A-applied Science and Manufacturing, 33
G. Scott, G. Astfalk (1990)
Thermal stresses in multilayer ceramic capacitors: numerical simulationsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 13
Sang Lee, U. Paik, Y. Shin, Jae Kim, Yeon‐Gil Jung (2003)
Control of residual stresses with post process in BaTiO3-based Ni-MLCCsMaterials & Design, 24
Y. Nakano, T. Nomura, T. Takenaka (2003)
Residual Stress of Multilayer Ceramic Capacitors with Ni-Electrodes (Ni-MLCCs)Japanese Journal of Applied Physics, 42
K. Prume, Klaus Franken, U. Böttger, R. Waser, H. Maier (2002)
Modelling and numerical simulation of the electrical, mechanical, and thermal coupled behaviour of Multilayer capacitors (MLCs)Journal of The European Ceramic Society, 22
A three‐dimensional finite element model describing the thermal–mechanical stress distribution in multilayer ceramic capacitors (MLCCs) during termination firing, soldering, and bending tests is presented. Numerical results indicate that the thermal residual stresses originating from the soldering process are approximately one‐fifth to half of the magnitude of the flexural stresses at the crack occurrence during the board flex test. The peak tensile stress from numerical simulations correlates with the crack initiation site observed in situ in board flex tests. The effects of inner electrode number, solder wicking height, lateral margin length, and the thickness of nickel in the termination component on mechanical failure during the board flex test are also investigated. Numerical results demonstrate that the maximum tensile stress could be effectively relieved by increasing the length of the lateral margin. In addition, a judicious combination of the solder wicking height and nickel termination thickness can further diminish the peak tensile stress during the board flex test. Finally, better design criteria are also developed by modifying the geometric parameters of MLCCs using Taguchi orthogonal arrays to decrease the peak tensile stresses that occur during board flex tests.
International Journal of Applied Ceramic Technology – Wiley
Published: Mar 1, 2015
Read and print from thousands of top scholarly journals.
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Copy and paste the desired citation format or use the link below to download a file formatted for EndNote
Access the full text.
Sign up today, get DeepDyve free for 14 days.
All DeepDyve websites use cookies to improve your online experience. They were placed on your computer when you launched this website. You can change your cookie settings through your browser.