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Optimizing the IC wire bonding process using a neural networks/genetic algorithms approach

Optimizing the IC wire bonding process using a neural networks/genetic algorithms approach A critical aspect of wire bonding is the quality of the bonding strength that contributes the major part of yield loss to the integrated circuit assembly process. This paper applies an integrated approach using a neural networks and genetic algorithms to optimize IC wire bonding process. We first use a back-propagation network to provide the nonlinear relationship between factors and the response based on the experimental data from a semiconductor manufacturing company in Taiwan. Then, a genetic algorithms is applied to obtain the optimal factor settings. A comparison between the proposed approach and the Taguchi method was also conducted. The results demonstrate the superiority of the proposed approach in terms of process capability. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Intelligent Manufacturing Springer Journals

Optimizing the IC wire bonding process using a neural networks/genetic algorithms approach

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References (26)

Publisher
Springer Journals
Copyright
Copyright © 2003 by Kluwer Academic Publishers
Subject
Business and Management; Production; Manufacturing, Machines, Tools; Control, Robotics, Mechatronics
ISSN
0956-5515
eISSN
1572-8145
DOI
10.1023/A:1022959631926
Publisher site
See Article on Publisher Site

Abstract

A critical aspect of wire bonding is the quality of the bonding strength that contributes the major part of yield loss to the integrated circuit assembly process. This paper applies an integrated approach using a neural networks and genetic algorithms to optimize IC wire bonding process. We first use a back-propagation network to provide the nonlinear relationship between factors and the response based on the experimental data from a semiconductor manufacturing company in Taiwan. Then, a genetic algorithms is applied to obtain the optimal factor settings. A comparison between the proposed approach and the Taguchi method was also conducted. The results demonstrate the superiority of the proposed approach in terms of process capability.

Journal

Journal of Intelligent Manufacturing – Springer Journals

Published: Oct 5, 2004

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