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Ying Li, Wenling Jia, Yanyan Song, X. Xia (2007)
Superhydrophobicity of 3D Porous Copper Films Prepared Using the Hydrogen Bubble Dynamic TemplateChemistry of Materials, 19
Ri Qiu, X. Zhang, Ru Qiao, Yan Li, Yeong-Il Kim, Y. Kang (2007)
CuNi Dendritic Material: Synthesis, Mechanism Discussion, and Application as Glucose SensorChemistry of Materials, 19
H. Shin, Jian‐Guo Dong, Meilin Liu (2003)
Nanoporous Structures Prepared by an Electrochemical Deposition ProcessAdvanced Materials, 15
Guangyang Li, Xueping Li, Hong Wang, Zhuo-qing Yang, J. Yao, G. Ding (2012)
Fabrication and characterization of superhydrophobic surface by electroplating regular rough micro-structures of metal nickelMicroelectronic Engineering, 95
N. Nikolić, G. Branković, V. Maksimović, M. Pavlović, K. Popov (2010)
Application of pulsating overpotential regime on the formation of copper deposits in the range of hydrogen co-depositionJournal of Solid State Electrochemistry, 14
Jae Lee, K. Bae, K. Jung, J. Jeong, J. Ko (2014)
Creation of microstructured surfaces using Cu–Ni composite electrodeposition and their application to superhydrophobic surfacesApplied Surface Science, 289
C. Gu, Tong-Yi Zhang (2008)
Electrochemical synthesis of silver polyhedrons and dendritic films with superhydrophobic surfaces.Langmuir : the ACS journal of surfaces and colloids, 24 20
Zhu Liu, Guoqiang Xia, F. Zhu, S. Kim, N. Marković, C. Chien, P. Searson (2008)
Exploiting finite size effects in a novel core/shell microstructureJournal of Applied Physics, 103
F. Walsh, M. Herron (1991)
Electrocrystallization and electrochemical control of crystal growth: fundamental considerations and electrodeposition of metalsJournal of Physics D, 24
Argoul, Arnéodo, Grasseau, Swinney (1988)
Self-similarity of diffusion-limited aggregates and electrodeposition clusters.Physical review letters, 61 22
Metastable Solution Thermodynamic Properties and Crystal Gro Kinetics
Weichun Ye, Junfeng Yan, Qian Ye, Feng Zhou (2010)
Template-Free and Direct Electrochemical Deposition of Hierarchical Dendritic Gold Microstructures: Growth and Their Multiple ApplicationsJournal of Physical Chemistry C, 114
Sai Hu, Wei Huang, Zelin Li (2010)
Facile fabrication of 3D dendritic gold nanostructures with an AuSn alloy by square wave potential pulseMaterials Letters, 64
T Hang, A Hu, H Ling, M Li, D Mao (2010)
Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodepositionAppl Surf Sci, 256
Y. Jung, B. Bhushan (2008)
Dynamic effects of bouncing water droplets on superhydrophobic surfaces.Langmuir : the ACS journal of surfaces and colloids, 24 12
Zhi Chen, Limei Hao, Anqi Chen, Q. Song, Changle Chen (2012)
A rapid one-step process for fabrication of superhydrophobic surface by electrodeposition methodElectrochimica Acta, 59
Kaufman, Nazzal, Melroy, Kapitulnik (1987)
Onset of fractal growth: Statics and dynamics of diffusion-controlled polymerization.Physical review. B, Condensed matter, 35 4
A. Ollivier, L. Muhr, S. Delbos, P. Grand, M. Matlosz, E. Chassaing (2009)
Copper–nickel codeposition as a model for mass-transfer characterization in copper–indium–selenium thin-film productionJournal of Applied Electrochemistry, 39
Sang Lee, I. Jung, J. Ko (2008)
The effect of the surface wettability of nanoprotrusions formed on network-type microstructuresJournal of Micromechanics and Microengineering, 18
F. Ke, Ling Huang, Jin-shu Cai, Shigang Sun (2007)
Electroplating synthesis and electrochemical properties of macroporous Sn-Cu alloy electrode for lithium-ion batteriesElectrochimica Acta, 52
S. Michaelis, Hans-Jörg Timme, M. Wycisk, J. Binder (2000)
Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applicationsJournal of Micromechanics and Microengineering, 10
F Argoul, A Arneodo, G Grasseau, HL Swinney (1988)
Self-similarity of diffusion-limited aggregates and electrodeposition clustersPhys Rev B, 61
Jeng‐Kuei Chang, S. Hsu, I. Sun, W. Tsai (2008)
Formation of Nanoporous Nickel by Selective Anodic Etching of the Nobler Copper Component from Electrodeposited Nickel−Copper AlloysJournal of Physical Chemistry C, 112
A. Cassie, S. Baxter (1944)
Wettability of porous surfacesTransactions of The Faraday Society, 40
T. Hang, Ming Li, A. Hu, D. Mao (2009)
Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition for appliance industry2009 International Conference on Electronic Packaging Technology & High Density Packaging
This research experimentally investigated how the solid fraction level of an array of projecting nickel cylindrical microstructures influenced the electrodeposition of Cu–Ni alloy on the cylindrical microstructures. The electrodeposition of Cu–Ni alloy on a substrate with an array of projecting cylindrical structures resulted in the concentrated precipitation of Cu ions at the top of the cylinders. Relatively more electrodeposited structures were formed at the top surface of the cylinders than at the bottom surface, and electrodeposited structures were not formed at the bottom surface of the substrate when the solid fraction was increased. Structures at the edges of the cylinders’ top surfaces grew larger than the structures at the centers of the surfaces. The heights of the electrodeposited structures decreased as the solid fraction increased. In addition, shadow bands with no electrodeposited structures were observed at the bottom surface of the substrate a certain distance away from the cylinders.
Journal of Materials Science – Springer Journals
Published: Sep 18, 2014
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