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Gold in thick film hybrid microelectronics

Gold in thick film hybrid microelectronics For a number of years microelectronic components have been made by screen printing patterns of resistive, conductive, insulating and dielectric pastes on to ceramic wafers and firing these in air to temperatures between 700 and 1000°C. Such thick film microcircuits are relatively inexpensive to make and offer a wide range of component values with good stable electrical properties. They have, therefore, found wide acceptance in industry and a substantial and increasing volume of thick film circuits is now being made. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Gold Bulletin Springer Journals

Gold in thick film hybrid microelectronics

Finch, R. G.
Gold Bulletin , Volume 5 (2) – Jun 1, 1972
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Publisher
Springer Journals
Copyright
Copyright © World Gold Council 1972
ISSN
2364-821X
eISSN
2190-7579
DOI
10.1007/bf03215155
Publisher site
See Article on Publisher Site

Abstract

For a number of years microelectronic components have been made by screen printing patterns of resistive, conductive, insulating and dielectric pastes on to ceramic wafers and firing these in air to temperatures between 700 and 1000°C. Such thick film microcircuits are relatively inexpensive to make and offer a wide range of component values with good stable electrical properties. They have, therefore, found wide acceptance in industry and a substantial and increasing volume of thick film circuits is now being made.

Journal

Gold Bulletin – Springer Journals

Published: Jun 1, 1972

Keywords: Thick Film; Glass Powder; Conductor Film; Sheet Resistivity; Cent Gold

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